SL 1 053 6 Z

Headers, Male Pins Overview

The SL 1 053 6 Z is a male pin header from the Fischer Elektronik SL 1 series. It features a single row with six contacts and a 2.54 mm pitch. The component utilizes a through-hole mounting style for secure PCB integration. Contact material is specified as CuSn-alloy, ensuring reliable electrical performance. The design supports board-to-board and wire-to-board connections within compact electronic assemblies.

Headers, Male Pins Feature Summary

• Single-row male pin configuration for standard interconnect applications
• Through-hole mounting technology for robust mechanical stability
• CuSn-alloy contact construction for durable electrical conductivity

Headers, Male Pins Applications

• Board-to-board signal transmission
• Wire-to-board connection interfaces
• General-purpose PCB header integration

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix matches the required contact count and row configuration. Confirm that the through-hole footprint aligns with the target PCB layout dimensions. Ensure compliance with RoHS standards if restricted substances are prohibited in the final assembly process.

Headers, Male Pins Selection Notes

Select this component when a single-row, six-position header is required. The 2.54 mm pitch is standard for general electronics. Consider the CuSn-alloy material for cost-effective durability. Validate insertion depth requirements against the mating connector specifications before finalizing the design.

Headers, Male Pins Part Context

This part belongs to the Fischer Elektronik SL 1 series of precision pin headers. The series offers various pole counts while maintaining consistent 2.54 mm pitch geometry. These components are designed for high-density electronic packaging where reliable signal integrity and mechanical retention are critical for long-term operational stability.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 2.54 mm pitch, single-row structure, and six-contact configuration. Verify identical through-hole mounting characteristics and compatible contact materials. Cross-reference physical dimensions to ensure spatial compatibility within the existing enclosure constraints.