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SL 1 230 35 G is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is ONE ROW, 0.635 MM. Review the specifications below when checking this part for your BOM.
The SL 1 230 35 G is a single-row male pin header connector manufactured by Fischer Elektronik. It features a 35-position configuration with a 2.54 mm (0.100 inch) contact pitch. The component utilizes copper-tin alloy contacts with selective gold plating for the mating surface and nickel plus minimum 4 micrometers of gold plating on the contact sleeve. Designed for through-hole mounting, it offers reliable electrical interconnection in electronic assemblies.
Verify the specific ordering suffix 'G' against the manufacturer's current datasheet to confirm exact plating specifications and packaging details. Ensure compatibility with standard 2.54 mm pitch mating connectors. Confirm RoHS compliance status if required for your specific application regulations before finalizing procurement orders.
Select this component when a 35-position single-row male header is required for through-hole PCB applications. The gold-plated contacts are suitable for environments requiring high reliability and low contact resistance. Consider the physical dimensions and thermal characteristics during layout planning to ensure adequate clearance and soldering integrity.
This part belongs to the Fischer Elektronik SL 1 series, which focuses on precision-engineered male pin headers. The series typically offers various contact counts and pitch options to accommodate diverse electronic design requirements. Components in this line are characterized by their robust construction and standardized dimensions for easy integration into existing systems.
Direct substitutes must match the 35-position count, 2.54 mm pitch, and single-row male configuration. Verify that alternative components offer compatible gold plating thickness and through-hole termination methods to ensure mechanical and electrical interchangeability without redesigning the PCB footprint.
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