SL 10 SMD 052 13 Z B SM

Headers, Male Pins Overview

The SL 10 SMD 052 13 Z B SM is a board connector manufactured by Fischer Elektronik. It features 13 contacts arranged in a single row with male straight surface mount terminals. The component utilizes a 0.635 mm (2.54 mm) pitch and incorporates a tin-plated contact finish. Designed for lead-free compliance, it supports staggered configurations within the SL series. The part is supplied in bar magazine packaging.

Headers, Male Pins Feature Summary

• Surface mount terminal design for direct PCB integration
• Tin-plated contact finish for reliable electrical connection
• Staggered configuration option available within the series

Headers, Male Pins Applications

• Electronic board-to-board interconnections
• Surface mount assembly processes
• Precision electronic device integration

Headers, Male Pins Procurement Notes

Verify the specific suffix 'Z' confirms tin plating as documented. Confirm 'B SM' indicates bar magazine packing per official datasheets. Ensure compatibility with 0.635 mm pitch requirements. Check RoHS compliance status against current manufacturer declarations. Validate pin count matches the 13-contact specification.

Headers, Male Pins Selection Notes

Select this component when surface mount mounting is required for 13-position connections. The 0.635 mm pitch suits high-density applications. Tin plating offers cost-effective conductivity. Verify that straight orientation fits the mechanical layout. Confirm staggered configuration needs if applicable.

Headers, Male Pins Part Context

This part belongs to the Fischer Elektronik SL series of pin headers. The SL 10 SMD variant specifically targets surface mount technology. The series provides various contact counts and plating options. This model represents a mid-range position count in the SMD lineup.

Headers, Male Pins Replacement Considerations

Consult Fischer Elektronik documentation for exact substitutes. Cross-reference pitch and contact count strictly. Verify plating type equivalence. Ensure package compatibility before substitution.