SL 10 SMD 062 34 G B SM

Headers, Male Pins Overview

The Fischer Elektronik SL 10 SMD 062 34 G B SM is a surface-mount connector header featuring 34 positions with a 0.100 inch (2.54 mm) pitch. It utilizes a gold-plated contact surface for enhanced conductivity and corrosion resistance. The component operates within a temperature range of -40°C to +163°C and withstands a test voltage of 2000 V. Designed for reliable PCB integration, it supports nominal voltages up to 250 V AC.

Headers, Male Pins Feature Summary

• Surface-mount design for automated assembly processes
• Gold-plated contacts ensure stable electrical performance
• High-temperature resistant insulating body material

Headers, Male Pins Applications

• Industrial control systems requiring robust connectivity
• Consumer electronics manufacturing
• Telecommunications equipment interfaces

Headers, Male Pins Procurement Notes

Verify the specific suffix codes against official datasheets to confirm pin count and plating specifications. Ensure compatibility with standard reflow soldering profiles. Confirm that the 34-position configuration matches the target circuit board layout requirements before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this model when high-density surface-mount interconnection is required. The 2.54 mm pitch offers a balance between spacing and density. Gold plating is preferred for environments demanding long-term reliability and low contact resistance compared to tin alternatives.

Headers, Male Pins Part Context

This component belongs to the SL 10 SMD series by Fischer Elektronik, specialized in precision-engineered electronic connectors. The series focuses on compact designs suitable for modern surface-mount technology applications, providing secure mechanical and electrical connections for various electronic assemblies.

Headers, Male Pins Replacement Considerations

Direct substitutes include variants within the same SL 10 SMD series with matching position counts and pitch specifications. Verify equivalent thermal ratings and contact plating materials to ensure functional parity without redesigning the host printed circuit board.