SM662PXC BFST

Memory IC Overview

The SM662PXC BFST is a non-volatile NAND Flash memory component organized as 64G x 8, providing a total capacity of 512Gbit. It utilizes eMMC interface technology and employs TLC (Triple-Level Cell) storage architecture. The device is housed in a 153-BGA package with dimensions of 11.5x13 mm. It operates within an extended temperature range of -25°C to 85°C.

Memory IC Feature Summary

• Integrates eMMC interface for standardized connectivity
• Utilizes TLC NAND flash technology for high density
• Designed for extended industrial temperature operation

Memory IC Applications

• Embedded mobile devices requiring high-capacity storage
• Industrial control systems needing wide temperature tolerance
• Consumer electronics utilizing eMMC standards

Memory IC Procurement Notes

Verify the specific suffix BFST against official Silicon Motion documentation to confirm exact binning or testing specifications. Ensure compatibility with host controllers supporting eMMC protocols. Confirm package integrity upon receipt. Cross-reference the 153-BGA footprint with PCB design files. Validate operating temperature ranges against system thermal requirements before integration.

Memory IC Selection Notes

Select this component when a 512Gbit capacity is required within a compact 153-BGA form factor. The eMMC interface simplifies board layout compared to parallel NAND solutions. Consider the -25°C to 85°C range for environments exceeding standard commercial limits. Verify that the host system supports the specific voltage levels and command sets defined in the eMMC specification.

Memory IC Part Context

This part belongs to the Ferri-eMMC series from Silicon Motion, Inc., which focuses on integrated flash solutions. The company specializes in NAND flash controller technologies. This specific model represents a high-density option within their portfolio, targeting applications demanding reliable non-volatile storage in constrained spaces.

Memory IC Replacement Considerations

Direct substitutes must match the 153-BGA package, 512Gbit capacity, and eMMC interface. Verify pinout compatibility and electrical characteristics. Consult Silicon Motion for qualified alternatives if supply constraints exist. Ensure any replacement maintains the same temperature rating and organization.