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SN74AUC16244GQLR is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUFFER NON-INVERT 2.7V 56BGA. Review the specifications below when checking this part for your BOM.
The SN74AUC16244GQLR is a 16-bit buffer and driver with 3-state outputs from the Texas Instruments Widebus family. It operates at supply voltages ranging from 0.8 V to 2.7 V, optimized for 1.8-V operation. The device features symmetrical active-low output-enable inputs and supports partial-power-down mode via Ioff circuitry. It provides an input voltage tolerance of up to 3.6 V, enabling mixed-mode signal operation. Key electrical characteristics include a maximum propagation delay of 2 ns at 1.8 V, ±8-mA output drive capability, and low power consumption with a maximum ICC of 20 μA.
Verify the specific package marking MH244 corresponds to the GQL (VFBGA) variant when sourcing. Confirm the RoHS status and lead finish details against the latest Package Option Addendum. Ensure compatibility with the specified -40°C to 85°C operating temperature range for your application environment.
Select this component for designs requiring sub-1-V operability and high-speed performance with minimal power consumption. The 3.6-V tolerant inputs allow interfacing with higher voltage logic without level shifters. Consider the VFBGA package constraints regarding thermal management and PCB layout requirements for the GQL suffix.
This part belongs to the SN74AUC16244 series within the Texas Instruments Widebus family. It is functionally compatible with other variants in the same logical family but differs in packaging. The GQL suffix specifically denotes the VFBGA package type, distinguishing it from TSSOP or TVSOP alternatives like the DGGR or DGVR.
SN74AUC16244DGGR and SN74AUC16244DGVR are functional equivalents within the same family but utilize different packages (TSSOP and TVSOP respectively). Verify pinout and thermal characteristics before substituting, as the physical footprint differs significantly from the VFBGA package.
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