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SN74HC645NS is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is PROTOTYPE. Review the specifications below when checking this part for your BOM.
The SN74HC645NS is an octal bus transceiver from the Texas Instruments HC logic series, housed in a 20-pin PDIP package for through-hole installation. It features non-inverting CMOS input and output levels with three-state outputs. The device operates within a supply voltage range of 2 V to 6 V and supports a working temperature range of -40 °C to +85 °C. Key electrical parameters include a maximum high-level output current of -7.8 mA and a maximum low-level output current of 7.8 mA. Propagation delay is specified at 135 ns under a 150 pF load at 2 V.
Verify the specific suffix 'N' confirms the PDIP-20 through-hole package variant distinct from surface-mount options like 'DWR'. Confirm RoHS compliance status via the manufacturer's official documentation prior to integration. Ensure the ordering part number matches the exact pinout and electrical specifications required for the target PCB layout. Cross-reference the datasheet revision date to guarantee alignment with current manufacturing standards.
Select this component when an octal, non-inverting bus transceiver with three-state outputs is required for through-hole assembly. The HC series offers CMOS compatibility suitable for general-purpose digital logic applications operating between 2 V and 6 V. Consider the propagation delay characteristics relative to system clock speeds. Verify that the 20-pin DIP footprint aligns with existing board designs or prototyping needs.
This device belongs to the SN74HC645 family of octal bus transceivers designed for Texas Instruments' high-speed CMOS logic portfolio. It serves as a bridge for bidirectional data transfer in complex digital circuits. The HC technology ensures low power consumption while maintaining noise immunity comparable to older LS series devices. This specific part represents the through-hole packaging option within the broader product line.
Publicly confirmed substitute part numbers are not available in the provided source material.
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