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SN74HCT244N is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUF NON-INVERT 5.5V 20DIP. Review the specifications below when checking this part for your BOM.
The SN74HCT244N is an octal buffer and line driver manufactured by Texas Instruments, utilizing HCT CMOS technology. It operates within a supply voltage range of 4.5 V to 5.5 V. The device features eight non-inverting inputs and outputs with three-state capability. It is housed in a 20-pin PDIP package designed for through-hole mounting. Key electrical parameters include a maximum static current of 8 µA and output drive currents of ±6 mA at 5 V. The propagation delay is specified as 45 ns at 4.5 V. The component supports an operating temperature range from -40 °C to +85 °C.
Verify the specific suffix 'NE4' against the base part number 'SN74HCT244N'. Confirm that the procurement matches the required PDIP-20 through-hole package type. Ensure the logic family corresponds to HCT specifications for voltage compatibility. Check RoHS compliance status if environmental regulations apply to the assembly process.
Select this component when designing systems requiring high-density octal buffering with three-state isolation. It is suitable for applications needing TTL-compatible inputs driven by CMOS logic. Consider the 20-pin DIP form factor for prototyping or legacy board designs requiring through-hole integration. Evaluate the 4.5 V to 5.5 V operating window against system power rails.
This device belongs to the SN74HCT244 series of octal buffers and line drivers. The series includes variants such as SN74HCT244DWR and SN74HCT244NSR, which offer surface-mount packaging options like SOIC and SSOP. All variants share the same core logical functionality but differ in physical footprint and mounting style to accommodate diverse PCB layout requirements.
Direct substitutes include SN74HCT244DWR and SN74HCT244NSR. These alternatives provide identical logical performance but utilize surface-mount packages instead of the through-hole PDIP configuration.
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