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SN74LVC1G00DBVRE4 is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC GATE NAND 1CH 2-INP SOT23-5. Review the specifications below when checking this part for your BOM.
The SN74LVC1G00DBVRE4 is a single 2-input positive NAND gate from the Texas Instruments LVC logic family. It operates within a supply voltage range of 1.65 V to 5.5 V and supports low-level output currents of 32 mA and high-level output currents of -32 mA. The device exhibits a propagation delay of approximately 3.8 ns. It functions reliably across an extended temperature range from -40°C to +125°C. The component is housed in a compact SOT-23-5 surface-mount package, designed for space-constrained digital applications requiring robust CMOS performance.
Verify the complete part number including the suffix RE4 to confirm tape-and-reel packaging configuration. Ensure compatibility with RoHS standards as indicated by manufacturer documentation. Confirm that the SOT-23-5 footprint matches the target PCB layout constraints. Validate that the operating voltage requirements align with the system power rails before integration.
Select this component when a compact NAND gate is required for low-voltage digital circuits. The LVC series offers improved switching speeds compared to older logic families while maintaining low power consumption. Consider the SOT-23-5 package size for dense board layouts. Verify that the 32 mA drive strength meets the load requirements of connected inputs without exceeding electrical limits.
This device belongs to the SN74LVC1Gxx series of single-function gates manufactured by Texas Instruments. The LVC (Low-Voltage CMOS) family is engineered for high-speed operation with wide voltage flexibility. These components are widely used in modern embedded systems where miniaturization and energy efficiency are critical design parameters.
Compatible substitutes include SN74LVC1G00DBVR and SN74LVC1G00DCKRE4. Verify pinout consistency and electrical specifications before substitution. Ensure the alternative package type fits the existing board footprint or allows for re-design.
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