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SN74LVC827ADGVR is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUF NON-INVERT 3.6V 24TVSOP. Review the specifications below when checking this part for your BOM.
The SN74LVC827ADGVR is a Texas Instruments buffer and line driver belonging to the LVC logic series. It features ten input lines and three-state outputs housed in a TVSOP-24 package. The device operates within a supply voltage range of 1.65 V to 3.6 V, with a maximum static current of 10 uA. Propagation delay is specified at 7.1 ns at 2.7 V and 6.7 ns at 3.3 V. Output drive capability provides 24 mA for both high and low states. It functions as a non-inverting buffer suitable for surface-mount applications across industrial temperature ranges.
Verify the specific suffix 'DGVR' corresponds to the TVSOP-24 package and reel packaging configuration. Confirm RoHS compliance status through official manufacturer documentation prior to implementation. Ensure the ordering part number matches the required logic family and pinout specifications exactly to avoid functional mismatches during assembly.
Select this component when ten-channel non-inverting buffering with tri-state capability is required. The LVC series offers compatibility with standard CMOS logic levels while supporting lower voltage operations. Consider the TVSOP-24 package constraints for PCB layout and thermal management requirements relative to the intended operating environment and signal integrity needs.
This device is part of the SN74LVC827A family of 10-bit buffers. It complements other Texas Instruments logic solutions designed for high-speed digital applications. The LVC series focuses on low voltage performance and reduced power consumption compared to legacy counterparts, making it suitable for modern portable and battery-operated electronic designs requiring efficient signal routing.
Check for SN74LVC827ADGVRE4 or SN74LVC827ADGVRG4 variants which may offer identical electrical characteristics with different environmental compliance markings. Verify package dimensions and pin assignments remain compatible before substituting.
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