RF Amplifiers SST12LP17E-QU8E product image

SST12LP17E-QU8E

$0.74
  • Description:IC AMP 802.11B/G/N 2.4GHZ 8UDFN
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:0241a4f4be7e Category: Brand:

  
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SST12LP17E-QU8E is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC AMP 802.11B/G/N 2.4GHZ 8UDFN. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for SST12LP17E-QU8E

  • Description:IC AMP 802.11B/G/N 2.4GHZ 8UDFN
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency:2.4GHz ~ 2.5GHz
  • P1dB:24dBm
  • Gain:29dB
  • Noise Figure:-
  • RF Type:802.11b/g/n
  • Voltage - Supply:3.3V
  • Current - Supply:-
  • Test Frequency:-
  • Mounting Type:Surface Mount
  • Package / Case:8-UDFN
  • Supplier Device Package:8-uDFN (2x2)
  • Grade:-
  • Qualification:-

RF Amplifiers datasheet and documents for SST12LP17E-QU8E

SST12LP17E-QU8E

RF Amplifiers Overview

The SST12LP17E-QU8E is a fully integrated, high-efficiency power amplifier module designed for 2.4 GHz wireless applications. It utilizes InGaP/GaAs HBT technology to deliver high gain and excellent linearity within an 8-uDFN (2x2) package. The device requires only one DC bypass capacitor for optimum performance, simplifying the design process. It supports 802.11b/g/n standards, operating in the 2.4 GHz to 2.5 GHz frequency range with typical added EVM of approximately 3% at 18 dBm output power.

RF Amplifiers Feature Summary

  • Fully matched power amplifier module architecture requiring minimal external components
  • High-efficiency operation based on reliable InGaP/GaAs HBT technology
  • Excellent linearity suitable for high-speed data transmission requirements

RF Amplifiers Applications

  • 802.11b/g/n WLAN systems
  • Bluetooth low energy transmitters
  • ISM band wireless communication devices

RF Amplifiers Procurement Notes

Verify the specific ordering suffix QU8E against the manufacturer's current datasheet to confirm package type and tape-and-reel specifications. Ensure compatibility with the target PCB footprint and thermal management requirements. Confirm that the component meets all relevant regulatory standards for the intended market. Cross-reference the part number with official Microchip documentation to avoid substitution errors.

RF Amplifiers Selection Notes

Select this component when a compact, high-gain PA solution is required for 2.4 GHz ISM band applications. The integrated nature reduces board space and simplifies RF layout compared to discrete solutions. Consider the thermal characteristics of the 8-uDFN package for heat dissipation in dense designs. Evaluate the single capacitor requirement against system complexity reduction goals.

RF Amplifiers Part Context

This part belongs to Microchip's SST12LP series of power amplifiers, which are optimized for wireless connectivity. The series focuses on providing high performance in small form factors. The SST12LP17E variant specifically targets efficiency and linearity for modern Wi-Fi and Bluetooth protocols. It represents a mature technology node for cost-effective RF front-end modules.

RF Amplifiers Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult Microchip directly for potential cross-reference options or updated revisions.

SST12LP17E-QU8ESST12LP17E-QU8E
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