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STM32MP251CAL3 is listed in the Microprocessors range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is STM32MP251CAL3. Review the specifications below when checking this part for your BOM.
The STM32MP251CAL3 is a microprocessor IC from the STM32MP2 series, manufactured by STMicroelectronics. It integrates heterogeneous processing capabilities with an Arm Cortex-A35 core running at 1.2 GHz, an Arm Cortex-M33 core at 400 MHz, and an Arm Cortex-M0+ core at 200 MHz. The device features a 361-VFBGA package (10x10 mm) and supports DDR3L, DDR4, and LPDDR4 memory controllers. It includes a 3D GPU, single Ethernet port, USB 2.0/3.0 interfaces, and operates within a temperature range of -40°C to 125°C TJ.
Verify component authenticity through authorized STMicroelectronics distributors or certified partners. Confirm package integrity and moisture sensitivity level handling procedures prior to assembly. Ensure supply chain documentation matches the specific STM32MP251CAL3 part number to avoid substitution errors with similar variants in the STM32MP2 family.
Select this model when a balance of moderate application performance and robust security is required without the higher cost of dual Cortex-A cores. The 1.2 GHz Cortex-A35 frequency suits applications where extreme graphical throughput is not critical. Verify external memory requirements against the supported DDR3L/DDR4/LPDDR4 controllers to optimize bill of materials.
This component belongs to the STM32MP2 series, designed as general-purpose microprocessors for industrial markets. It succeeds previous generations by offering enhanced security certifications and improved power efficiency through the Cortex-A35 and Cortex-M33 combination. The series targets developers seeking mainline Linux support via OpenSTLinux.
STM32MP251DAL3 offers identical architecture but with a higher Cortex-A35 clock speed of 1.5 GHz. STM32MP251A provides a single Cortex-A35 core variant. Direct pin-to-pin replacements within the same package require verification of thermal specifications and software configuration compatibility.
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