SY10EP51VZI

Flip Flops Overview

The SY10EP51VZI is a single ECL D-type flip-flop with reset, manufactured by Microchip Technology. It features a single-ended input and differential outputs, housed in an 8-SOIC package. The device operates within a supply voltage range of 3 V to 5.5 V and supports a propagation delay of 0.37 ns. It provides high-level output current of -50 mA and low-level output current of 50 mA. The component functions across an industrial temperature range from -40°C to +85°C.

Flip Flops Feature Summary

• Provides differential clock data output for high-speed signal integrity
• Integrates a reset function for synchronous control
• Supports both inverting and non-inverting polarity configurations

Flip Flops Applications

• High-speed data acquisition systems
• Differential clock distribution networks
• ECL logic interface circuits

Flip Flops Procurement Notes

Verify the specific suffix (ZG vs ZI) against the official datasheet to confirm package type and tape/reel specifications. Ensure the selected variant matches the required operating temperature range and humidity sensitivity class for the target application environment before finalizing procurement.

Flip Flops Selection Notes

Select this component when a single ECL D-flip-flop with reset is required in an 8-pin surface-mount package. Consider the 0.37 ns propagation delay and differential output drive capabilities for timing-critical designs. Verify compatibility with the system's ECL power supply levels and input signal characteristics.

Flip Flops Part Context

This part belongs to the SY10EP51V series of ECL flip-flops. It is distinct from the SY10EP51VKG which uses an MSOP-8 package. The ZI suffix typically denotes the SOIC-8 package configuration. It serves as a fundamental building block for sequential logic in high-speed ECL applications.

Flip Flops Replacement Considerations

The SY10EP51VZG is a pin-compatible alternative in an MSOP-8 package. The SY10EP51VZI-TR offers the same functionality in a tape-and-reel format. Verify mechanical footprint and reflow profile requirements when substituting.