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SY55858UHG-TR is listed in the Signal Switches, Multiplexers, Decoders range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC CROSSPOINT SW 2 X 2:2 32TQFP. Review the specifications below when checking this part for your BOM.
The SY55858UHG-TR is a low-voltage, high-speed dual 2 x 2 crosspoint switch from the SuperLite family. It features flexible inputs accepting CML or PECL signals and provides fully differential 50Ω compatible CML outputs. The device supports non-blocking switching with configurable modes including dual 2:1 mux, dual 1:2 fanout buffer, 1:4 fanout buffer, quad buffer, or dual 2 x 2 switch. It operates on a single supply voltage ranging from 2.3V to 3.6V and functions within an industrial temperature range of –40 °C to +85°C.
Verify that the specific ordering suffix 'TR' corresponds to the Tape and Reel packaging format as documented in the manufacturer's ordering information. Confirm the component meets Pb-Free specifications if required by the assembly process. Ensure compatibility with the 32-pin EPAD-TQFP package dimensions during PCB layout. Validate that the selected variant aligns with the intended industrial operating temperature range.
Select this component when a dual 2 x 2 crosspoint switch with CML or PECL inputs is required. Consider the unique VT pin functionality for interfacing with various logic standards. Evaluate the 3.0GHz maximum frequency capability against system timing requirements. Assess the need for non-blocking switching versus simpler mux or buffer configurations to optimize design complexity.
This part belongs to the SuperLite series of high-speed interface components manufactured by Microchip Technology (originally Micrel). It is designed for applications requiring precise signal routing and distribution at multi-gigabit data rates. The device integrates multiple switching functions into a single package to reduce board space and simplify system architecture.
The SY55858UHI is listed as a direct substitute. Verify package compatibility and electrical parameter alignment before implementation.
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