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TC74HC14APF is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is IC INVERT SCHMITT 6CH 1INP 14DIP. Review the specifications below when checking this part for your BOM.
The TC74HC14APF is a hex Schmitt inverter manufactured by Toshiba Semiconductor and Storage using silicon gate C2MOS technology. It features six independent inverters with Schmitt trigger inputs providing hysteresis for noise immunity. The device operates within a supply voltage range of 2 V to 6 V, drawing a maximum quiescent current of 1 µA at 25°C. Typical propagation delay is 11 ns at 5 V, with a maximum of 21 ns under specified conditions. Output drive capability supports up to 10 LSTTL loads with symmetrical output impedance.
Verify the specific package type matches the required application, as the TC74HC14A series includes DIP, SOP, and SOL options. Confirm RoHS3 compliance status through official Toshiba documentation prior to procurement. Ensure design accounts for absolute maximum ratings, particularly regarding power dissipation derating factors above 65°C. Validate that operating temperature ranges align with system requirements.
Select this component when high noise immunity is required due to its Schmitt trigger characteristics. It serves as a functional replacement for 74LS14 devices while offering lower power consumption typical of CMOS logic. Consider the wide operating voltage range suitable for various digital systems. Verify pin compatibility if substituting into existing designs originally utilizing LS-TTL families.
This part belongs to the TC74HC14A family of hex Schmitt inverters from Toshiba. It shares pin configuration and functionality with the TC74HC04A but incorporates Schmitt triggers. The AP suffix indicates a 14-pin DIP package. The device utilizes C2MOS technology to achieve performance levels similar to LSTTL while retaining standard CMOS advantages.
The datasheet explicitly states pin and function compatibility with the 74LS14.
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