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TLE2064MDRG4 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP JFET 4 CIRCUIT 14SOIC. Review the specifications below when checking this part for your BOM.
The TLE2064MDRG4 is a quad low-power JFET-input operational amplifier manufactured by Texas Instruments. It features high output drive capability with an output current of 80 mA per channel and a supply current of 1.25 mA for the four-channel configuration. The device operates within a voltage range of 7 V to 36 V single supply or ±3.5 V to ±18 V dual supply. Key electrical parameters include a gain-bandwidth product of 2 MHz, a slew rate of 3.4 V/µs, and an input bias current of 4 pA. It is housed in a 14-SOIC package.
Verify the exact suffix against official Texas Instruments documentation to confirm pinout and electrical specifications. Ensure the component meets RoHS compliance requirements for your specific manufacturing process. Cross-reference the datasheet revision date to validate parameter accuracy before finalizing the bill of materials.
Select this component when high input impedance and low bias current are critical for signal integrity. The quad architecture reduces board space compared to single-channel alternatives. Consider the SOIC-14 package constraints for thermal management and PCB layout. Verify that the required output current does not exceed the specified limits under all operating conditions.
This part belongs to the TLE206x family of precision operational amplifiers from Texas Instruments. The series is characterized by JFET inputs combined with bipolar output stages to balance low noise with high drive strength. The TLE2064 variant specifically integrates four channels into a single package, offering a compact solution for multi-channel analog processing systems.
Check for direct pin-compatible substitutes such as the TLE2064IN or TLE2064CD if availability is an issue. Ensure any replacement maintains the same JFET input characteristics and output drive capabilities. Verify that the alternative package type matches the existing PCB footprint and soldering profile.
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