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TLP5214A(D4,E is listed in the Isolators - Gate Drivers range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISO 5KV 1CH GATE DVR 16SO. Review the specifications below when checking this part for your BOM.
The TLP5214A(D4,E is a smart gate driver optocoupler designed for IGBT and power MOSFET applications. It integrates an infrared LED with a photo-IC in a 16-SO package, delivering a peak output current of 4 A. Key electrical parameters include a 5000 Vrms isolation voltage, 35 kV/µs common-mode transient immunity, and a propagation delay of 150 ns. The device operates within a supply voltage range of 15 V to 30 V and supports junction temperatures from -40°C to +110°C.
Verify the specific suffix (D4) against the manufacturer's datasheet to confirm packaging type and tape/reel specifications. Ensure the component meets RoHS compliance requirements for your region. Cross-reference the ordering code with official Toshiba Semiconductor and Storage documentation to avoid substitution errors due to minor packaging variations.
Select this component when high isolation voltage and fast switching speeds are required for IGBT or MOSFET control. The integrated smart features, such as under-saturation detection and active Miller clamp, simplify design by reducing external component count. Ensure the application environment stays within the specified temperature range and that the input current does not exceed maximum ratings.
This part belongs to the TLP5214 series of smart gate driver optocouplers. It is engineered for high-reliability power electronics where galvanic isolation and robust noise immunity are critical. The series typically offers various packaging options to suit different PCB layout constraints while maintaining consistent electrical performance characteristics.
Check for direct substitutes like TLP5214A(TP,E or TLP5214A(E, ensuring pinout compatibility and identical electrical ratings. Verify that any replacement maintains the same 16-SO package dimensions and thermal characteristics to fit existing footprints without redesign.
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