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TLP621-4BLSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISO 5.3KV 4CH TRANS 16-SMD. Review the specifications below when checking this part for your BOM.
The TLP621-4BLSM is a quad-channel phototransistor optocoupler manufactured by Isocom Components. It features a surface-mount package with 16 pins, providing electrical isolation between input and output circuits. The device supports a maximum forward current of 50 mA and offers an isolation voltage of 5300 Vrms. Typical rise and fall times are specified at 2 μs and 3 μs respectively. It operates within a temperature range of -30°C to 100°C and complies with UL standards.
Verify the specific suffix BLSM against official manufacturer documentation to confirm surface-mount configuration and pinout compatibility. Ensure that the operating temperature range and isolation voltage meet the target application requirements before integration. Cross-reference datasheet parameters for current transfer ratio and switching times to validate performance expectations.
Select this component when multiple isolated channels are required in a single package to reduce board space. Consider the surface-mount form factor for automated assembly processes. Evaluate the 5300 Vrms isolation rating against system safety standards. Compare switching speeds with other available options if high-frequency signal transmission is critical for the design.
This part belongs to the TLP621 series of phototransistor optocouplers from Isocom Components. The series is designed for general-purpose isolation applications. The BLSM variant specifically denotes a surface-mount package option, differing from through-hole DIP versions like the TLP621-4GB. It shares core electrical characteristics with other members of the family while offering distinct physical packaging.
Direct substitutes include TLP621-4GB and TLP621-4X, which offer identical electrical specifications but utilize different through-hole packages. Verify pinout compatibility and thermal management requirements when transitioning between surface-mount and through-hole variants.
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