Instrumentation, Op Amps, Buffer Amps TLV2170IDR product image

TLV2170IDR

$1.01
  • Description:IC OPAMP GP 2 CIRCUIT 8SOIC
  • Series:-
  • Mfr:Texas Instruments
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:530376e6ce1d Category: Brand:

  
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TLV2170IDR is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP GP 2 CIRCUIT 8SOIC. Review the specifications below when checking this part for your BOM.

Instrumentation, Op Amps, Buffer Amps specifications for TLV2170IDR

  • Description:IC OPAMP GP 2 CIRCUIT 8SOIC
  • Series:-
  • Mfr:Texas Instruments
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Amplifier Type:General Purpose
  • Number of Circuits:2
  • Output Type:Rail-to-Rail
  • Slew Rate:0.4V/µs
  • Gain Bandwidth Product:1.2 MHz
  • Current - Input Bias:10 pA
  • Voltage - Input Offset:500 µV
  • Current - Supply:125µA (x2 Channels)
  • Current - Output / Channel:17 mA
  • Voltage - Supply Span (Min):2.7 V
  • Voltage - Supply Span (Max):36 V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOIC
  • -3db Bandwidth:-

Instrumentation, Op Amps, Buffer Amps datasheet and documents for TLV2170IDR

TLV2170IDR

Instrumentation, Op Amps, Buffer Amps Overview

The TLV2170IDR is a dual-channel general-purpose operational amplifier manufactured by Texas Instruments. It features a gain-bandwidth product of 1.2 MHz and a slew rate of 0.4 V/µs. The device operates within a supply voltage range of 2.7 V to 36 V, with a maximum supply current of 125 µA for both channels. It provides an output current of 17 mA per channel and exhibits a low input bias current of 10 pA. The input offset voltage is specified at 500 µV. The component is housed in an 8-SOIC package and supports an operating temperature range from -40°C to 125°C.

Instrumentation, Op Amps, Buffer Amps Feature Summary

  • Dual-channel architecture providing two independent amplifiers in a single package
  • Rail-to-rail output capability for maximum dynamic range
  • Low power consumption suitable for battery-operated applications
  • High input impedance with low bias current characteristics

Instrumentation, Op Amps, Buffer Amps Applications

  • Signal conditioning circuits requiring low power operation
  • Sensor interface applications utilizing high-impedance sources
  • General-purpose analog signal processing tasks
  • Portable instrumentation systems constrained by power budgets

Instrumentation, Op Amps, Buffer Amps Procurement Notes

Verify the specific ordering suffix to ensure the correct packaging format, such as tape and reel or cut tape, matches the assembly requirements. Confirm that the 8-SOIC package dimensions align with the printed circuit board footprint design. Ensure the thermal management strategy accommodates the specified operating temperature range of -40°C to 125°C for the intended application environment.

Instrumentation, Op Amps, Buffer Amps Selection Notes

Select this component when a dual-channel configuration is required alongside rail-to-rail output performance. The low supply current makes it appropriate for energy-efficient designs. Consider the 1.2 MHz bandwidth and 0.4 V/µs slew rate for moderate-speed signal processing needs. The wide supply voltage range offers flexibility in system power architecture choices compared to lower-voltage alternatives.

Instrumentation, Op Amps, Buffer Amps Part Context

This part belongs to the TLVx170 series of operational amplifiers from Texas Instruments. The series includes variants with different channel counts, such as the single-channel TLV170 and the dual-channel TLV2170. These devices are designed to offer a balance of performance and power efficiency for general-purpose analog applications.

Instrumentation, Op Amps, Buffer Amps Replacement Considerations

The OPA2170AIDR is a documented alternative within the same family, offering similar electrical specifications but potentially differing in precision grades or packaging options. Verify pin compatibility and parameter tolerances before substitution.

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