TLV320AIC23IPWG4

Codecs Overview

The TLV320AIC23IPWG4 is a high-performance stereo audio codec manufactured by Texas Instruments, housed in a 28-pin TSSOP package. It supports sampling rates from 8 kHz to 96 kHz with data word lengths of 16, 20, 24, and 32 bits. The device features a third-order multibit sigma-delta ADC with up to 90-dBA SNR and a second-order multibit DAC with up to 100-dBA SNR at 48 kHz. Operating conditions include an analog supply voltage range of 2.7 V to 3.6 V and a digital core supply range of 1.42 V to 3.6 V. The component operates within a temperature range of -40°C to +85°C.

Codecs Feature Summary

• Integrates highly efficient linear headphone amplifiers capable of delivering 30 mW per channel into 32 Ω loads.
• Supports software-controlled power management with standby consumption under 150 µW and power-down consumption under 15 µW.
• Includes complete electret microphone biasing and buffering solutions with low-noise current sources.

Codecs Applications

• Portable solid-state audio players
• Digital audio recorders
• MP3 digital audio players

Codecs Procurement Notes

Verify the specific suffix IPWG4 against the manufacturer's official documentation to confirm the TSSOP-28 package and industrial temperature rating (-40°C to +85°C). Ensure compatibility with required analog and digital supply voltages before integration. Confirm that the component meets all necessary environmental and electrical specifications for the target application environment.

Codecs Selection Notes

Select this component when designing portable audio systems requiring integrated stereo line inputs, microphone biasing, and headphone driving capabilities. The device is suitable for applications needing glueless interfaces with TI McBSP-compatible processors. Consider the available oversampling rates and digital filter characteristics when optimizing for specific DSP or USB interface requirements.

Codecs Part Context

The TLV320AIC23 series represents Texas Instruments' solution for compact, low-power stereo audio I/O. The IPWG4 variant specifically denotes the industrial temperature grade version packaged in a 28-pin Thin Shrink Small Outline Package (TSSOP). This packaging option provides a board area of 62 mm², offering a balance between size reduction and ease of assembly compared to smaller proprietary packages.

Codecs Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify functional equivalence with other members of the TLV320AIC23 family, such as the GQE package variants, ensuring pinout and electrical parameter alignment.