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TLV320DAC32IRHBR is listed in the ADCs/DACs - Special Purpose range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DAC 24BIT 96K 32VQFN. Review the specifications below when checking this part for your BOM.
The TLV320DAC32IRHBR is a low-power stereo audio digital-to-analog converter (DAC) from Texas Instruments, designed for portable devices. It features a 32-pin VQFN package and supports 16, 20, 24, and 32-bit data resolutions with sampling rates from 8 kHz to 96 kHz. The device integrates two DACs and offers high performance with a signal-to-noise ratio of 95 dBA. It includes programmable analog gains, microphone bias levels, and headphone jack detection. Power consumption is minimized, drawing only 18 mW during 48 kHz stereo playback at 3.3 V. It supports I2C control and various serial audio interfaces.
Verify the specific suffix IRHBR corresponds to the tape-and-reel packaging configuration required for automated assembly processes. Confirm that the operating voltage ranges align with the system's analog and digital power domains before integration. Ensure ESD handling protocols are followed due to the moisture sensitivity level associated with the QFN package type.
Select this component when a combined DAC and amplifier solution is needed to reduce board space and component count in portable designs. It is suitable for applications requiring high audio fidelity with minimal power consumption. Consider the integrated speaker driver capability if driving low-impedance loads directly without external amplification.
This part belongs to the TLV320DAC series of low-power audio converters. It is specifically engineered for the mobile and portable market where size and battery life are critical constraints. The device consolidates multiple audio functions into a single small footprint, simplifying the design process for manufacturers of handheld devices.
Check for pin-compatible alternatives within the same family if supply chain issues arise. Verify that any substitute maintains the same package dimensions and thermal characteristics to ensure mechanical fit.
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