TLV3401IP

Comparators Overview

The TLV3401IP is a single-channel analog comparator from Texas Instruments, housed in an 8-PDIP through-hole package. It operates on a supply voltage ranging from 2.5 V to 16 V with a typical quiescent current of 550 nA. The device features rail-to-rail input capability and an open-drain output capable of sourcing 10 mA. Key electrical specifications include a maximum input offset voltage of 3.6 mV, input bias current of 250 pA, and a propagation delay of up to 300 µs. It functions within a temperature range of -40°C to +125°C.

Comparators Feature Summary

• Nanopower consumption for extended battery life
• Rail-to-rail input stage compatibility
• Open-drain CMOS output interface

Comparators Applications

• Battery-powered monitoring systems
• Threshold detection circuits
• General-purpose signal comparison

Comparators Procurement Notes

Verify the specific ordering suffix to confirm the PDIP-8 package and industrial temperature grade. Ensure the component meets RoHS compliance requirements for your assembly process. Cross-reference the manufacturer part number against official datasheets to validate pinout and electrical characteristics before integration.

Comparators Selection Notes

Select this component when low static current is critical alongside single-supply operation. The open-drain output requires an external pull-up resistor. Verify that the required propagation speed aligns with the 300 µs maximum delay specification rather than high-speed applications.

Comparators Part Context

This part belongs to the TLV340x family of nanopower comparators. It shares functional similarities with other members like the TLV3402 and TLV3404, which offer dual and quad channels respectively. The IP suffix specifically denotes the plastic dual in-line package suitable for through-hole mounting.

Comparators Replacement Considerations

Direct pin-compatible alternatives within the same family include the TLV3401CD (SOIC package) or TLV3401CDBVR (SOT-23 package). Verify package dimensions and thermal performance when substituting surface-mount variants for through-hole designs.