TOP253MN

AC DC Converters, Offline Switchers Overview

The TOP253MN is an integrated off-line switcher from the TOPSwitch-HX family, incorporating a 700 V power MOSFET and PWM control. It supports high-side switching with a 15.2 Ω RdsOn and operates at a fixed frequency of 132 kHz. The device delivers up to 26 W output power with a maximum duty cycle of 83%. It functions within a -40 °C to +150 °C temperature range using a 10-pin SDIP-C package.

AC DC Converters, Offline Switchers Feature Summary

• Integrates EcoSmart technology for low no-load power consumption
• Combines high-voltage switched current source with oscillator
• Includes advanced protection features for system reliability

AC DC Converters, Offline Switchers Applications

• Universal input AC/DC converters
• Battery chargers
• General purpose isolated power supplies

AC DC Converters, Offline Switchers Procurement Notes

Verify the specific suffix against official datasheets to confirm pinout and thermal characteristics. Ensure the selected variant matches the required isolation voltage and package dimensions for your PCB layout. Cross-reference manufacturer part numbers directly to avoid compatibility issues with existing designs.

AC DC Converters, Offline Switchers Selection Notes

Select this component for applications requiring high efficiency and compact design without external gate drive components. Consider the 700 V rating for mains-connected systems. Evaluate thermal performance requirements given the 150 °C maximum operating temperature limit in enclosed environments.

AC DC Converters, Offline Switchers Part Context

This part belongs to the TOPSwitch-HX series, designed for cost-effective power conversion. It integrates the controller, power switch, and protection circuits into a single monolithic IC. This integration reduces component count and simplifies design compared to discrete solutions.

AC DC Converters, Offline Switchers Replacement Considerations

TOP253PN offers similar functionality in a DIP-8C package. Verify pin compatibility and thermal dissipation differences when substituting between DIP and SDIP packages.