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TT320N16SOFTIMHPSA1 is listed in the SCRs - Modules range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is LT-BOND MODULE. Review the specifications below when checking this part for your BOM.
The TT320N16SOFTIMHPSA1 is a phase control thyristor module from Infineon's Eco Block series, utilizing solder-bond technology. It features an electrically insulated base plate and a 50 mm industrial standard package. The device supports a repetitive peak forward and reverse voltage of 1600 V with a maximum average on-state current (ITAVM) of 320 A at TC=85°C. Surge current capacity reaches 9500 A for 10 ms. Key electrical parameters include a threshold voltage (VT0) of 0.77 V, slope resistance (rT) of 0.58 mΩ, and a thermal resistance junction-to-case (RthJC) of 0.11 K/W at 180° conduction.
Verify the specific ordering suffix TIMHPSA1 against official Infineon documentation to confirm the inclusion of pre-applied thermal interface material. Ensure compatibility with existing cooling solutions and verify that the solder-bond termination method aligns with the target PCB or busbar assembly processes.
Select this component for high-current phase control applications requiring a 1600 V blocking capability. Evaluate the thermal management strategy based on the RthJC value of 0.11 K/W and the maximum junction temperature limit of 130°C. Consider the critical rate of rise of on-state current (di/dt) of 100 A/µs when designing gate drive circuits to ensure safe turn-on conditions.
This module belongs to the TT320N16SOF family within Infineon's Bipolar Power Semiconductors portfolio. It is designed for high-power industrial environments where reliability under heavy surge currents is critical. The 50 mm form factor allows for standardized integration into existing power conversion architectures commonly used in medium-voltage drives.
Direct replacements must match the 1600 V rating, 320 A current class, and 50 mm package dimensions. Verify equivalent di/dt ratings and thermal resistance values. Solder-bond modules may require different handling compared to press-pack types; ensure mechanical mounting torque specifications are compatible with the replacement design.
The critical rate of rise of on-state current is specified as 100 A/µs according to DIN IEC 747-6 standards.
Yes, the suffix indicates that the module comes with pre-applied thermal interface material (TIM) on the base plate to facilitate heat sink attachment.
The operating temperature range extends up to a maximum case temperature corresponding to the junction limit, with a maximum junction temperature (Tvj max) of 130°C.
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