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VNS3NV04TR-E is listed in the Power Distribution Switches, Load Drivers range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC PWR DRIVER N-CHANNEL 1:1 8SO. Review the specifications below when checking this part for your BOM.
The VNS3NV04TR-E is a single-channel N-channel power switch and driver from the OMNIFET II family. It integrates a MOSFET with a dedicated gate driver in an 8-SOIC package. The device supports a maximum supply voltage of 40V and delivers a peak output current of 3.5A. Key electrical parameters include a typical on-resistance of 120 milliohms and switching times of 30 microseconds for both rise and fall. It operates within a temperature range of -40°C to 150°C junction temperature.
Verify the specific ordering suffix to confirm the tape and reel packaging configuration required for automated assembly processes. Ensure that the selected variant matches the exact pinout and thermal requirements of the target PCB design. Cross-reference the manufacturer's latest documentation to confirm compliance with current environmental standards and RoHS directives before finalizing procurement orders.
Select this component when a compact solution for driving low-side loads is required. The integrated driver simplifies circuit design by eliminating external gate drive components. Consider the 120 milliohm on-resistance for power loss calculations. Verify that the 3.5A output current capability meets the peak load demands of the application without triggering internal protection mechanisms.
This part belongs to STMicroelectronics' VIPower and OMNIFET II families, which are designed for robust power management applications. These devices combine high-voltage MOSFET technology with intelligent control features. The series is widely used in automotive and industrial sectors where reliability and compact form factors are critical for system integration and performance optimization.
The VNS3NV04PTR-E is a documented substitute offering identical functionality in an 8-SOIC package. Both parts share the same core specifications and protection features. Ensure that the alternative package variant fits the available footprint on the printed circuit board before implementing any substitution strategy.
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