VS-6CWQ10FNTRPBF

Diode Arrays Overview

The VS-6CWQ10FNTRPBF is a surface mount, center tap Schottky rectifier in a D-PAK (TO-252AA) package. It provides a maximum average forward current of 7 A per device and a maximum DC reverse voltage of 100 V. The component features a low forward voltage drop of 0.63 V at 3 A and 125 °C junction temperature. Maximum reverse leakage current is 4.9 mA at 125 °C. The junction temperature range spans from -40 to +150 °C.

Diode Arrays Feature Summary

• Center tap configuration with common cathode base for dual anode operation
• Guard ring structure designed to enhance ruggedness and long term reliability
• Low forward voltage drop characteristics optimized for high frequency operation
• Surface mountable design within a small footprint D-PAK outline

Diode Arrays Applications

• Disk drives
• Switching power supplies
• Converters
• Freewheeling diodes
• Battery charging circuits

Diode Arrays Procurement Notes

Verify the TR suffix indicates tape and reel packaging rather than tube format. Confirm lead-free compliance status matches project requirements. Validate that the specific ordering code aligns with the required quantity per reel. Ensure storage conditions remain within specified limits prior to assembly.

Diode Arrays Selection Notes

Select this component when a compact surface mount solution requires a center tap topology. Evaluate thermal resistance values against the expected heat dissipation needs. Consider the 100 V rating relative to peak reverse voltages in the target circuit. Assess the forward voltage drop impact on overall system efficiency during conduction phases.

Diode Arrays Part Context

This part belongs to Vishay's high performance Schottky rectifier series designed for demanding power conversion applications. The product line emphasizes robust performance through specialized guard ring technology. The D-PAK package offers a balance between current handling capability and board space constraints for modern electronic designs.

Diode Arrays Replacement Considerations

Check datasheet compatibility for pinout and thermal characteristics before substitution. Verify electrical ratings meet or exceed original design specifications. Ensure package dimensions match existing PCB footprints without modification.