SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AirBorn VSM-06-30-080-50-00-L is a rectangular MIL-DTL-83513 connector from the verSI series. It features a vertical male plug configuration with 6 rows and 30 columns, providing 180 positions. The unit utilizes a 1.27 mm pitch and press-fit termination style for board mounting. Gold contact plating ensures reliable signal integrity. Designed for high-density applications, it supports straight installation angles and operates within standard military environmental specifications.
Verify the specific suffix 'L' against official Molex/AirBorn documentation to confirm material or coating variations distinct from standard 'G' or 'N' suffixes. Ensure compatibility with existing guide pin holes and jacknut configurations. Confirm RoHS status and current revision level prior to procurement. Cross-reference part number buildup codes to validate row, column, and spacing parameters.
Select this component when a vertical male connector with press-fit termination is required for high-density interconnects. The 6-row by 30-column layout offers 180 circuits in a compact footprint. Verify that the target PCB thickness accommodates the press-fit tail length and that guide pin provisions match the housing design. Ensure operating temperatures align with the specified range.
This part belongs to the AirBorn verSI series, which provides high-density interconnect solutions compliant with MIL-DTL-83513. The series supports various termination styles including press-fit and through-hole. The VSM designation indicates a vertical male plug configuration. These connectors are engineered for demanding environments where signal integrity and mechanical durability are critical.
Direct substitutes must match the 6x30 pin count, 1.27mm pitch, and press-fit termination. Verify equivalent MIL-DTL-83513 compliance. Alternative suffixes may differ in plating or housing material; consult manufacturer cross-reference guides for verified equivalents.

If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More