SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AirBorn VSM-08-10-100-50-03-L is a rectangular military specification connector from the verSI series. It features a plastic body with a 0.050-inch (1.27mm) pitch and supports 8 rows and 10 columns for a total of 80 circuits. Designed as a vertical plug, it utilizes through-hole termination with a 0.109-inch tail length. The component specifies a 10.00mm board spacing and includes a guide pin compatible with a maximum board thickness of 0.125 inches.
Verify the specific suffix 'L' against official Molex/AirBorn documentation to confirm plating specifications and material composition. Ensure compatibility with mating receptacles within the same verSI series. Confirm that the guide pin requirements align with the target printed circuit board layout and thickness constraints.
Select this component when a vertical male interface is required for board-to-board connections. The 1.27mm pitch allows for high density while maintaining robust mechanical stability. Verify that the through-hole termination method suits the manufacturing process and that the 10-row by 8-column configuration meets the circuit count requirements.
This part belongs to the AirBorn verSI family of open-pin field connectors. The series offers various mounting styles including vertical and right-angle options. These connectors are engineered for demanding applications requiring high reliability and durability under extreme physical stress.
Direct substitutes must match the 1.27mm pitch, 80-position count, and vertical through-hole form factor. Verify that any alternative maintains the same MIL-DTL-83513 compliance and guide pin dimensions to ensure mechanical interchangeability.

In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More