SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The VSM-08-50-100-50-04-N1 is a rectangular military specification connector from the AirBorn verSI series, manufactured by Molex. It features a 0.050-inch (1.27mm) pitch with a plastic body and vertical through-hole termination. The component provides 400 circuits arranged in 10 columns and 4 rows. It includes fixed jacknuts for board mounting with a maximum board thickness of 0.125 inches.
Verify the specific revision level and environmental sealing requirements against the project specifications. Confirm that the fixed jacknut configuration matches the chassis panel thickness constraints. Ensure compatibility with the mating receptacle series to guarantee proper interconnection integrity.
Select this model for high-density interconnects requiring MIL-DTL-83513 compliance. The 0.050-inch pitch supports significant circuit density within constrained volumes. Verify that the vertical through-hole mounting style aligns with the PCB assembly process and mechanical stability needs.
This component belongs to the AirBorn verSI family of open-pin field connectors. These connectors are designed for harsh environments and offer flexible contact arrangements. The series is widely used in aerospace and defense sectors where reliability under extreme conditions is critical.
Direct substitutes must match the MIL-DTL-83513 standard and physical dimensions. Verify pin count, row/column configuration, and termination type before substitution.

Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read More
Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More