Memory IC W25Q32FVSFBQ product image

W25Q32FVSFBQ

  • Description:IC FLASH 32MBIT SPI/QUAD 16SOIC
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tube

SKU:b4b3dd3e4ba2 Category: Brand:

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W25Q32FVSFBQ is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 32MBIT SPI/QUAD 16SOIC. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W25Q32FVSFBQ

  • Description:IC FLASH 32MBIT SPI/QUAD 16SOIC
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tube
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:50µs, 3ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package:16-SOIC
  • Access Time:7 ns

Memory IC datasheet and documents for W25Q32FVSFBQ

W25Q32FVSFBQ

Memory IC Overview

The W25Q32FVSFBQ is a 32-Mbit (4M x 8-bit) Serial NOR Flash memory manufactured by Winbond Electronics. It operates on a single 2.7V to 3.6V power supply and supports standard SPI, Dual SPI, Quad SPI, and QPI interfaces with clock frequencies up to 104 MHz. The device features an array organized into 16,384 programmable pages of 256 bytes each, supporting sector, block, and chip erase operations. It is housed in an 8-pin TSSOP package and functions within a temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed data transfer via standard, dual, quad SPI, and QPI modes for efficient code execution and data storage.
  • Features flexible memory architecture with uniform 4KB sectors and larger block erase capabilities for versatile parameter storage.
  • Includes hardware and software write protection mechanisms alongside security registers to safeguard stored data integrity.

Memory IC Applications

  • Code shadowing to RAM for system initialization
  • Direct code execution from flash (XIP)
  • Storage of voice, text, and configuration data

Memory IC Procurement Notes

Verify the specific suffix 'BQ' against official Winbond documentation to confirm the exact package type and tape-and-reel specifications. Ensure compatibility with existing board layouts regarding pin pitch and thermal requirements. Confirm RoHS compliance status for the specific manufacturing batch prior to integration.

Memory IC Selection Notes

Select this component for applications requiring moderate density non-volatile storage with flexible interface options. Consider the 104 MHz maximum clock speed for performance needs. Evaluate the TSSOP-8 footprint constraints against available PCB space. Compare against other W25Q series variants if higher capacity or different voltage ranges are required.

Memory IC Part Context

This part belongs to the W25Q32 family of Serial NOR Flash memories designed for systems with limited space and pins. It provides enhanced flexibility and performance compared to ordinary serial flash devices. The family is widely used in consumer electronics, industrial controls, and communication equipment where reliable data retention and fast access are critical.

Memory IC Replacement Considerations

Compatible substitutes include W25Q32FVSSIQ and W25Q32FVSSIG. Verify that replacement parts match the required operating voltage range and support the necessary Quad SPI or QPI modes for equivalent performance.

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