Memory IC W631GG6KS-12 product image

W631GG6KS-12

  • Description:IC DRAM 1GBIT 96VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:df5255dad4a6 Category: Brand:

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W631GG6KS-12 is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 1GBIT 96VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W631GG6KS-12

  • Description:IC DRAM 1GBIT 96VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:-
  • Memory Format:DRAM
  • Technology:-
  • Memory Size:1Gbit
  • Memory Organization:64M x 16
  • Memory Interface:-
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:96-VFBGA
  • Supplier Device Package:96-VFBGA (7.5x13)
  • Access Time:-

Memory IC datasheet and documents for W631GG6KS-12

W631GG6KS-12

Memory IC Overview

The W631GG6KS-12 is a 1 Gbit DDR3 SDRAM manufactured by Winbond Electronics. It features a parallel interface with a data bus width of 16 bits and an organization of 64 M x 16. The component supports a maximum clock frequency of 800 MHz with a typical access time of 20 ns. It operates within a supply voltage range of 1.425 V to 1.575 V and is housed in a 96-VFBGA package measuring 7.5x13 mm. Designed for surface mount technology, it functions reliably across a temperature range of -40°C to +95°C.

Memory IC Feature Summary

  • High-density 1 Gbit storage capacity utilizing DDR3 SDRAM technology
  • Parallel memory interface supporting 16-bit data bus width
  • Industrial-grade operational temperature range for robust performance
  • Compact 96-pin VFBGA surface-mount packaging

Memory IC Applications

  • Embedded systems requiring high-density volatile memory
  • Industrial control equipment operating in extreme temperatures
  • Consumer electronics utilizing DDR3 architecture
  • Automotive infotainment and control modules

Memory IC Procurement Notes

Verify current manufacturing status as this component may be subject to discontinuation notices. Confirm package dimensions and pinout compatibility with existing PCB layouts. Ensure supply chain sources provide authentic Winbond Electronics products to avoid counterfeit risks. Check for specific RoHS compliance documentation if required by regional regulations. Validate moisture sensitivity level handling procedures during assembly.

Memory IC Selection Notes

Select this part when a 1 Gbit DDR3 solution with a 16-bit interface is required. The 800 MHz speed grade suits applications needing moderate bandwidth. The industrial temperature range makes it suitable for harsh environments. Compare against the W631GG6KB15I for similar specifications but verify package differences between VFBGA and WBGA variants before integration.

Memory IC Part Context

This component belongs to the Winbond W631GG6 series of DDR3 SDRAMs. It shares architectural similarities with other parts in the family, such as the W631GG6NB-12, differing primarily in speed grades and packaging options. The series provides scalable memory solutions for various embedded applications requiring reliable volatile data storage.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Designers should consult official manufacturer channels for qualified replacement components or updated lifecycle notifications.

W631GG6KS-12W631GG6KS-12

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