Memory IC W632GG6MB09J product image

W632GG6MB09J

  • Description:IC DRAM 2GBIT PAR 96VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:dea02ea43ab2 Category: Brand:

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W632GG6MB09J is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT PAR 96VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W632GG6MB09J

  • Description:IC DRAM 2GBIT PAR 96VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3
  • Memory Size:2Gbit
  • Memory Organization:128M x 16
  • Memory Interface:Parallel
  • Clock Frequency:1.067 GHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.425V ~ 1.575V
  • Operating Temperature:-40°C ~ 105°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-VFBGA
  • Supplier Device Package:96-VFBGA (7.5x13)
  • Access Time:20 ns

Memory IC datasheet and documents for W632GG6MB09J

W632GG6MB09J

Memory IC Overview

The W632GG6MB09J is a 2Gbit DDR3 SDRAM organized as 16M words x 8 banks x 16 bits. It supports speeds up to 2133 MT/s (DDR3-2133) with CL-tRCD-tRP timings of 14-14-14. The maximum operating frequency is 1066 MHz, and access time is 20 ns. Operating voltage is 1.5V ± 0.075V. It features an industrial plus temperature range of -40°C to 105°C and is packaged in a 96-ball VFBGA.

Memory IC Feature Summary

  • Supports double data rate architecture with two data transfers per clock cycle.
  • Includes eight internal banks for concurrent operation.
  • Features programmable on-die termination for improved signal integrity.
  • Provides asynchronous reset functionality for power-up initialization.

Memory IC Applications

  • High-speed memory systems requiring 2133 MT/s transfer rates
  • Industrial applications operating within extended temperature ranges
  • Embedded designs utilizing 16-bit parallel DDR3 interfaces

Memory IC Procurement Notes

Verify the specific speed grade suffix '09J' corresponds to the required 2133 MT/s performance and industrial plus temperature rating (-40°C to 105°C). Confirm package dimensions match the 96-ball VFBGA specification. Ensure supply chain sources provide authentic Winbond Electronics components to avoid counterfeit risks.

Memory IC Selection Notes

Select this component when a 2Gbit capacity with a 16-bit data bus width is required. Choose the 09J variant specifically for environments demanding operation up to 105°C case temperature. Consider the 1066 MHz maximum frequency limit when designing system clocks.

Memory IC Part Context

This device belongs to the W632GG6MB series of DDR3 SDRAMs manufactured by Winbond Electronics. The series includes various speed grades and temperature ratings, with the 09J suffix denoting the highest performance tier suitable for demanding industrial conditions.

Memory IC Replacement Considerations

Compatible substitutes include other W632GG6MB variants such as W632GG6MB09I or W632GG6MB09J from Winbond. Cross-vendor replacements must match the 2Gbit density, 16-bit organization, and 96-VFBGA package constraints.

Memory IC FAQ

What is the maximum operating frequency for the W632GG6MB09J?

The maximum operating frequency is 1066 MHz, corresponding to the DDR3-2133 speed grade.

Does the W632GG6MB09J support auto-refresh at high temperatures?

Yes, but it requires enabling Auto Self-Refresh mode or using Manual Self-Refresh with Extended Temperature Range capability due to the doubled refresh command frequency at temperatures above 85°C.

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