Memory IC W632GU6NB11J product image

W632GU6NB11J

  • Description:IC DRAM 2GBIT PAR 96VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:f14f84988289 Category: Brand:

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W632GU6NB11J is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT PAR 96VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W632GU6NB11J

  • Description:IC DRAM 2GBIT PAR 96VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:2Gbit
  • Memory Organization:128M x 16
  • Memory Interface:Parallel
  • Clock Frequency:933 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:-40°C ~ 105°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-VFBGA
  • Supplier Device Package:96-VFBGA (7.5x13)
  • Access Time:20 ns

Memory IC datasheet and documents for W632GU6NB11J

W632GU6NB11J

Memory IC Overview

The W632GU6NB11J is a 2 Gbit DDR3L SDRAM organized as 128M x 16. It operates at a maximum frequency of 933 MHz with an access time of 20 ns. The device supports a supply voltage range of 1.283V to 1.45V and functions within a case temperature range of -40°C to 105°C. Packaged in a 96-ball VFBGA (7.5x13 mm), it features eight internal banks, 8-bit prefetch architecture, and programmable CAS latency.

Memory IC Feature Summary

  • Supports high-speed data transfer rates up to 2133 MT/s compliant with DDR3L-1866 specifications.
  • Features eight internal banks for concurrent operation and double data rate architecture.
  • Includes on-die termination (ODT) and ZQ calibration for improved signal integrity.
  • Provides asynchronous reset functionality and support for partial array self-refresh.

Memory IC Applications

  • Industrial control systems requiring extended temperature stability
  • Automotive electronics applications
  • Embedded memory solutions for communication equipment

Memory IC Procurement Notes

Verify the specific ordering suffix 'J' confirms the industrial plus grade temperature rating of -40°C to 105°C. Confirm package type matches the required 96-VFBGA footprint. Check RoHS compliance status and moisture sensitivity level requirements before integration into the manufacturing process.

Memory IC Selection Notes

Select this component when an industrial plus grade environment is required alongside DDR3L-1866 performance. Ensure the system design accommodates the 1.35V typical supply voltage while maintaining backward compatibility if 1.5V operation is necessary. Verify that the PCB layout supports the fine-pitch ball grid array package dimensions.

Memory IC Part Context

This part belongs to the W632GU6NB series of 2Gbit DDR3L SDRAMs manufactured by Winbond Electronics. The series includes various speed grades and temperature ratings to suit different application needs. The '11J' designation specifically identifies the 1866 MT/s speed bin combined with the enhanced industrial temperature range.

Memory IC Replacement Considerations

W632GU6RB11I

Memory IC FAQ

What does the 'J' suffix indicate in the model number?

The 'J' suffix indicates the Industrial Plus grade, which guarantees operation within a case temperature range of -40°C to 105°C.

Is this device compatible with standard 1.5V DDR3 supplies?

Yes, the device is backward compatible with VDD and VDDQ voltages of 1.5V ± 0.075V, in addition to its primary 1.35V operation.

W632GU6NB11JW632GU6NB11J

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