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W632GU6NB11J is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT PAR 96VFBGA. Review the specifications below when checking this part for your BOM.
The W632GU6NB11J is a 2 Gbit DDR3L SDRAM organized as 128M x 16. It operates at a maximum frequency of 933 MHz with an access time of 20 ns. The device supports a supply voltage range of 1.283V to 1.45V and functions within a case temperature range of -40°C to 105°C. Packaged in a 96-ball VFBGA (7.5x13 mm), it features eight internal banks, 8-bit prefetch architecture, and programmable CAS latency.
Verify the specific ordering suffix 'J' confirms the industrial plus grade temperature rating of -40°C to 105°C. Confirm package type matches the required 96-VFBGA footprint. Check RoHS compliance status and moisture sensitivity level requirements before integration into the manufacturing process.
Select this component when an industrial plus grade environment is required alongside DDR3L-1866 performance. Ensure the system design accommodates the 1.35V typical supply voltage while maintaining backward compatibility if 1.5V operation is necessary. Verify that the PCB layout supports the fine-pitch ball grid array package dimensions.
This part belongs to the W632GU6NB series of 2Gbit DDR3L SDRAMs manufactured by Winbond Electronics. The series includes various speed grades and temperature ratings to suit different application needs. The '11J' designation specifically identifies the 1866 MT/s speed bin combined with the enhanced industrial temperature range.
W632GU6RB11I
The 'J' suffix indicates the Industrial Plus grade, which guarantees operation within a case temperature range of -40°C to 105°C.
Yes, the device is backward compatible with VDD and VDDQ voltages of 1.5V ± 0.075V, in addition to its primary 1.35V operation.
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