W632GU8QB09I

$3.19

Description：IC DRAM 2GBIT PAR 78VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tray

SKU:dffe216f9b26 Category: Memory IC Brand: Winbond Electronics

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Product introduction

W632GU8QB09I is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT PAR 78VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W632GU8QB09I

Description：IC DRAM 2GBIT PAR 78VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tray
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - DDR3L
Memory Size：2Gbit
Memory Organization：256M x 8
Memory Interface：Parallel
Clock Frequency：1.067 GHz
Write Cycle Time - Word, Page：15ns
Voltage - Supply：1.283V ~ 1.45V
Operating Temperature：-40°C ~ 95°C (TC)
Mounting Type：Surface Mount
Package / Case：78-VFBGA
Supplier Device Package：78-VFBGA (8x10.5)
Access Time：20 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for W632GU8QB09I

W632GU8QB09I

Memory IC Overview

The W632GU8QB09I is a 2 Gbit DDR3L SDRAM manufactured by Winbond Electronics. It features an x8 data bus width and a 256 M x 8 organization, housed in a 78-VFBGA package. The device supports a maximum clock frequency of 1.06 GHz (1066 MHz) with an access time of 180 ps. Operating voltage ranges from 1.283 V to 1.45 V. It is rated for industrial temperatures between -40°C and +95°C. This component is designated as End-of-Life and will be discontinued.

Memory IC Feature Summary

Supports low-voltage operation at 1.35V typical with backward compatibility to 1.5V
Utilizes double data rate architecture for high-speed data transfer
Includes eight internal banks for concurrent operations
Features differential clock inputs and source-synchronized I/O

Memory IC Applications

Industrial embedded systems requiring wide temperature tolerance
Consumer electronics utilizing DDR3L memory interfaces
Automotive infotainment and control modules
Network infrastructure equipment

Memory IC Procurement Notes

This component is officially classified as End-of-Life by the manufacturer. Distribution availability is restricted or non-existent. Buyers must verify current stock status directly with authorized suppliers before ordering. Procurement should focus on last-time buy opportunities or approved replacement alternatives due to imminent discontinuation.

Memory IC Selection Notes

Select this part only if legacy design compatibility with 78-VFBGA packages and specific DDR3L timing parameters is required. Verify that the system power supply supports the 1.283V to 1.45V range. Consider the industrial temperature rating (-40°C to +95°C) against environmental requirements. Due to EOL status, evaluate long-term supply chain risks and potential redesign needs.

Memory IC Part Context

The W632GU8QB09I belongs to Winbond's W632GU series of DDR3L SDRAMs. This series provides high-density memory solutions optimized for low power consumption. The specific model offers a 2Gb capacity with an x8 interface, distinguishing it from wider bus variants like the x16 models in the same family. It targets applications needing reliable performance in compact form factors.