W66BP6NBHAHJ TR

$2.43

Description：IC DRAM 2GBIT LVSTL 11 100VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tape & Reel (TR)

SKU:10b41cb5d002 Category: Memory IC Brand: Winbond Electronics

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Product introduction

W66BP6NBHAHJ TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT LVSTL 11 100VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W66BP6NBHAHJ TR

Description：IC DRAM 2GBIT LVSTL 11 100VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tape & Reel (TR)
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - Mobile LPDDR4
Memory Size：2Gbit
Memory Organization：128M x 16
Memory Interface：LVSTL_11
Clock Frequency：2.133 GHz
Write Cycle Time - Word, Page：18ns
Voltage - Supply：1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature：-40°C ~ 105°C (TC)
Mounting Type：Surface Mount
Package / Case：100-VFBGA
Supplier Device Package：100-VFBGA (10x7.5)
Access Time：3.6 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for W66BP6NBHAHJ TR

W66BP6NBHAHJ TR

Memory IC Overview

The W66BP6NBHAHJ TR is a mobile LPDDR4 dynamic random-access memory (DRAM) integrated circuit manufactured by Winbond Electronics. It features a storage capacity of 2 Gbit with a memory organization of 128M x 16. The device supports a maximum clock frequency of 2.133 GHz and has an access time of 3.6 ns. It operates within a voltage range of 1.06 V to 1.17 V and 1.7 V to 1.95 V, suitable for industrial temperatures from -40°C to +105°C. The component is housed in a 100-VFBGA package measuring 10x7.5 mm.

Memory IC Feature Summary

Supports LVSTL_11 interface standard for mobile applications
Industrial temperature rating ensures reliability in extreme environments
Low voltage operation optimizes power consumption

Memory IC Applications

Mobile computing devices requiring high-speed volatile memory
Industrial embedded systems operating in harsh thermal conditions
Automotive infotainment and control units

Memory IC Procurement Notes

Verify current manufacturing status as the component is listed as obsolete or end-of-life. Confirm availability through direct manufacturer channels or authorized distributors, as stock may be limited. Check for product change notifications regarding packaging or material composition updates before finalizing procurement plans.

Memory IC Selection Notes

Select this part for designs requiring 2 Gbit LPDDR4 density with industrial temperature tolerance. Ensure the PCB layout supports the 100-VFBGA footprint. Verify that the system power supply can accommodate the specified dual voltage ranges. Consider obsolescence status when planning long-term production lifecycles.

Memory IC Part Context

This component belongs to Winbond's W66 series of mobile LPDDR4 DRAMs. It is designed for portable electronics and industrial applications where space efficiency and power management are critical. The 100-VFBGA package provides a compact form factor suitable for dense board layouts.