W66CL2NQUAHJ

Memory IC Overview

The W66CL2NQUAHJ is a 4Gb LPDDR4 SDRAM manufactured by Winbond Electronics, organized as 128M x 32. It operates at a maximum clock frequency of 1.6 GHz with an access time of 3.5 ns and a page write cycle time of 18 ns. The device supports dual voltage supplies ranging from 1.06V to 1.17V and 1.7V to 1.95V. It is housed in a 200-WFBGA (10x14.5) package and functions within a temperature range of -40°C to 105°C.

Memory IC Feature Summary

• Supports LVSTL_11 interface for mobile applications
• Dual-Die-Package (DDP) configuration available
• Includes comprehensive training features such as Write Leveling and RD DQ Calibration

Memory IC Applications

• Mobile devices requiring high-speed memory
• Consumer electronics utilizing LPDDR4 technology
• Communication systems operating in extended temperature ranges

Memory IC Procurement Notes

Verify the specific ordering suffix against official documentation to ensure correct package type and speed grade. Confirm that the component meets RoHS3 specifications and REACH requirements before integration. Check for any Product Change Notifications (PCNs) related to manufacturing updates or material changes.

Memory IC Selection Notes

Select this component for designs requiring 4Gb capacity with a 32-bit data bus width. Ensure the system power supply accommodates the specified dual voltage ranges. Verify compatibility with the host controller's support for LPDDR4 protocols and necessary calibration sequences.

Memory IC Part Context

This part belongs to the W66CL2NQ series of LPDDR4 memory devices. It is designed for mobile and specialty markets, offering high performance in a compact form factor. The series includes variants supporting different speeds and configurations.

Memory IC Replacement Considerations

Consult official datasheets for compatible substitutes within the W66CL2NQ family. Verify pinout and electrical characteristics match the original design requirements.