W987D6HBGX6I

Memory IC Overview

The Winbond W987D6HBGX6I is a 128Mb Mobile Low Power SDRAM (LPSDR) IC. It features a parallel interface with an x16 data bus width and operates at clock frequencies up to 166MHz. The device utilizes a 54-ball VFBGA package. Electrical specifications include a supply voltage range of 1.7V to 1.95V for both VDD and VDDQ. Access times are specified at 5.4ns for CAS Latency 3 and 6ns for CAS Latency 2. The memory organization is 2,097,152 words by 16 bits across four banks.

Memory IC Feature Summary

• Supports Partial Array Self Refresh (PASR) and Automatic Temperature Compensated Self Refresh (ATCSR) for optimized power management in battery-operated devices.
• Features Deep Power Down Mode (DPD) and programmable output buffer driver strength to reduce energy consumption during idle states.
• Includes LVCMOS bus interface compatible with 1.8V logic levels for seamless integration into mobile system architectures.

Memory IC Applications

• 2.5G and 3G cellular phones
• Personal Digital Assistants (PDA)
• Digital still cameras
• Mobile game consoles

Memory IC Procurement Notes

Verify the specific suffix 'X6I' against official documentation to confirm industrial temperature rating (-40°C to +85°C). Confirm package type matches the 54-ball VFBGA requirement. Check RoHS compliance status as per the latest datasheet revision. Ensure compatibility with existing PCB footprints before ordering.

Memory IC Selection Notes

Select this component when designing systems requiring low power consumption alongside high-density memory storage. The LPSDR technology offers significant power savings compared to standard SDRAM. Consider the available CAS latencies and burst lengths to match system timing requirements. Verify that the operating voltage range aligns with the target platform's power rails.

Memory IC Part Context

This part belongs to the Winbond W987D series of Mobile LPSDR memories. The series includes variants with different organizations such as x32 configurations. These components are engineered specifically for handheld applications where space and power efficiency are critical constraints. The family supports various speed grades to accommodate different performance needs.

Memory IC Replacement Considerations

Public confirmed substitute part numbers: None identified in source material.

Memory IC FAQ

What is the difference between PASR and ATCSR?

PASR allows users to configure the amount of memory refreshed during self-refresh mode to save power, while ATCSR automatically adjusts the refresh rate based on temperature to maintain data integrity without user intervention.

How does the Deep Power Down Mode function?

Deep Power Down Mode significantly reduces standby current by disabling most internal circuits. It requires a specific exit sequence to restore normal operation, making it suitable for long-term inactive periods in portable devices.