SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The WG62PR9J is a rectangular MIL-DTL-55302 series connector manufactured by Molex / AirBorn. It features a right-angle plug configuration with 62 positions arranged in three rows. The component utilizes gold-plated copper alloy pin contacts and a polyphenylene sulfide (PPS) housing. Designed for through-hole board mounting, it supports a wire gauge of 22 AWG. Electrical specifications include a current rating of 5 A, a voltage rating of 1 kV, and an insulation resistance of 5 GOhms. The operating temperature range spans from -65 C to +125 C, with a contact spacing of 2.54 mm.
Verify the specific suffix against official datasheets to confirm exact plating thickness and material variants. Ensure compatibility with mating receptacles within the same W Series family. Confirm RoHS compliance status if required for specific environmental regulations. Cross-reference the manufacturer part number with authorized distributor catalogs to avoid counterfeit components. Validate that the right-angle orientation matches the mechanical constraints of the target PCB layout.
Select this component when a high-density, three-row connection is required in a constrained space. The right-angle form factor facilitates compact circuit board arrangements. Verify that the 5 A current rating meets the load requirements of the application. Ensure the 2.54 mm pitch aligns with existing trace routing or mating connector standards. Consider the thermal limits of the PPS housing relative to the operational environment.
This part belongs to the AirBorn W Series, a line of rectangular connectors designed for demanding environments. The series offers various row counts and contact configurations to support diverse military and industrial needs. The WG62PR9J specifically addresses applications requiring robust performance under extreme temperatures and vibration.
Compatible mating parts include WG62SD9J and WG62SD9SY receptacles from the same series. Substitutes must maintain the 62-position count and 2.54 mm pitch. Verify mechanical dimensions and mounting hole patterns before integration.

Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
Choose tactile switches by operating force, travel, actuator height, footprint and lifetime. Check debounce, sealing and the assembled button mechanism.
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More