WG62PR9SY-5

Overview

The WG62PR9SY-5 is a rectangular MIL-DTL-55302 series connector manufactured by Molex / AirBorn. It features a right-angle plug design for board mount applications with 62 positions arranged in three rows. The component utilizes through-hole termination with gold-plated copper alloy pins and a polyphenylene sulfide (PPS) housing. Rated for 1 kV voltage, 5 A current, and an insulation resistance of 5 GOhms, it operates within a temperature range of -65°C to +125°C using a 2.54 mm pitch and 22 AWG wire gauge.

Feature Summary

• Complies with MIL-DTL-55302 military specifications for rugged reliability
• Features a right-angle plug configuration for efficient board space utilization
• Utilizes gold-plated contacts on a copper alloy base for conductivity
• Constructed with polyphenylene sulfide housing material

Applications

• Military aerospace electronic systems
• Aviation communication equipment
• Ruggedized industrial control panels

Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm exact pin count and row configuration. Ensure compatibility with mating receptacles from the same W Series family. Confirm RoHS compliance status via the latest certificate before procurement integration.

Selection Notes

Select this model for high-density interconnects requiring MIL-DTL-55302 certification. The three-row layout supports 62 positions within a compact footprint. Verify that the 2.54 mm pitch aligns with existing PCB trace designs and that the right-angle orientation fits the mechanical enclosure constraints.

Part Context

This component belongs to the AirBorn W Series, a line of rectangular connectors designed for demanding environments. The series offers various position counts and row configurations to meet diverse connectivity requirements while maintaining strict adherence to military performance standards.

Replacement Considerations

Cross-reference part numbers such as M55302/57B62X or equivalent MIL-DTL-55302 variants. Verify dimensional drawings and contact plating specifications to ensure functional interchangeability without redesigning the host assembly.