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XC7VX330T-3FFG1761E is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 700 I/O 1761FCBGA. Review the specifications below when checking this part for your BOM.
The XC7VX330T-3FFG1761E is a Virtex-7 FPGA manufactured by AMD using 28nm technology. It features 326,400 logic elements and 51,000 adaptive logic modules within a 1,761-ball FCBGA package. The device includes 28 GTH transceivers supporting data rates up to 28.05 Gb/s and provides 26.37 Mbit of embedded memory. Operating voltages range from 1.2 V to 3.3 V, with a maximum operating frequency of 640 MHz. It supports an industrial temperature range of 0°C to +100°C and offers 700 I/O pins for system integration.
Verify the specific suffix codes against official AMD documentation to confirm pinout compatibility and electrical specifications. Ensure that any ordering suffixes do not alter the functional characteristics unless explicitly stated in the datasheet. Confirm moisture sensitivity levels and recommended reflow profiles prior to assembly to maintain component integrity during manufacturing processes.
Select this model when design requirements demand high logic density combined with significant serial bandwidth capabilities. The inclusion of 28 GTH transceivers makes it suitable for applications needing substantial I/O throughput. Evaluate power consumption constraints relative to the 28nm process node benefits compared to older technology nodes for optimal system efficiency.
This component belongs to the AMD Virtex-7 family, which utilizes mature 28nm technology to deliver high performance and reliability. The series is designed for long-term availability, with product lifecycles extending through 2040. It serves as a scalable solution for demanding applications in communications, industrial automation, and aerospace sectors.
Consult official AMD cross-reference guides for verified substitutes. Potential alternatives within the same family include XC7VX415T or XC7VX485T for higher capacity needs, provided pin compatibility and thermal requirements are addressed.
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