XC7Z035-1FBG676I

Soc System On Chip Overview

The XC7Z035-1FBG676I is a Zynq-7000 All Programmable SoC integrating dual-core ARM Cortex-A9 processors with Kintex-7 FPGA fabric. It features a Processing System (PS) with up to 866 MHz clock speed, 512 KB shared L2 cache, and 256 KB on-chip memory. The Programmable Logic (PL) provides 275K logic cells, 17.6 Mb Block RAM, and 1,040 DSP slices. The device utilizes an FCBGA-676 package with 250 I/O pins and supports high-speed transceivers up to 17.6 Gb/s. Operating temperature range is -40°C to +100°C for the industrial grade variant.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining ARM Cortex-A9 processing system with Kintex-7 programmable logic
• High-bandwidth AXI interconnect enabling low-latency data exchange between PS and PL
• Accelerator Coherency Port (ACP) allowing direct hardware accelerator access to CPU cache
• Integrated peripherals including Ethernet MAC, USB 2.0 OTG, and multiple serial interfaces

Soc System On Chip Applications

• Industrial automation controllers requiring real-time processing
• Communication infrastructure baseband processing
• Medical imaging systems with embedded control logic
• Automotive infotainment and advanced driver assistance systems

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix (-1) against design timing requirements. Confirm the industrial temperature rating (-I) matches environmental specifications. Ensure the FCBGA-676 footprint aligns with PCB layout constraints. Check for moisture sensitivity level compliance during assembly. Validate power delivery network design for VCCINT and VCCO domains.

Soc System On Chip Selection Notes

Select this model when moderate FPGA resources are needed alongside robust ARM processing capabilities. Compare logic cell counts against Artix-7 based Zynq models for cost-performance balance. Evaluate DSP slice availability for signal processing workloads. Consider pin count limitations relative to external memory and peripheral interface requirements.

Soc System On Chip Part Context

This component belongs to the AMD Xilinx Zynq-7000 family, bridging the gap between pure FPGA solutions and traditional processors. It succeeds earlier Zynq-100 series devices by offering enhanced Kintex-7 performance. The FBG676 package size positions it between smaller CLG484 variants and larger FFG900 models in terms of resource density.

Soc System On Chip Replacement Considerations

XC7Z035-2FBG676I offers higher clock speeds but may require updated timing constraints. XC7Z035-L2FBG676I provides lower power consumption at reduced frequencies. XC7Z030-1FBG676I serves as a lower-resource alternative within the same package.