XCVC1802-2MSIVSVA2197

Soc System On Chip Overview

The AMD XCVC1802-2MSIVSVA2197 is a Versal AI Core Series Adaptive SoC designed for high-performance computing and AI acceleration. It integrates scalar processing units, including dual-core Arm Cortex-A72 and dual-core Arm Cortex-R5F processors, with programmable logic and specialized AI engines. The device features approximately 1.8 million system logic cells (K) and 836,480 Look-Up Tables (LUTs). It supports high-speed connectivity through PCIe Gen4 interfaces and includes integrated memory controllers for DDR4 and LPDDR4. The component utilizes a 2197-ball FCBGA package to facilitate dense board layouts.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining scalar processors, programmable logic, and dedicated AI engines for parallel workload execution
• Integrated programmable network-on-chip enabling high-bandwidth data transfer between on-chip resources
• Support for advanced memory interfaces including DDR4 and LPDDR4 for large dataset handling
• High-speed I/O capabilities with PCIe Gen4 support for external peripheral connectivity

Soc System On Chip Applications

• Data center network and storage acceleration
• SmartNIC implementations
• 5G xHaul infrastructure
• Nx100G Ethernet and OTN networking equipment
• Communications test and measurement devices

Soc System On Chip Procurement Notes

Verify the specific suffix '2MSIVSVA2197' against official AMD documentation to confirm temperature range, speed grade, and packaging details. Ensure compatibility with required development tools such as Vivado Design Suite and Vitis Unified Software Platform before procurement. Confirm RoHS compliance status and moisture sensitivity level requirements for your assembly process.

Soc System On Chip Selection Notes

Select this model when design requirements demand significant AI engine density alongside robust scalar processing capabilities. Compare logic cell counts and DSP engine availability against alternative Versal Prime or AI Edge series parts to ensure optimal resource utilization. Evaluate thermal management solutions suitable for the FCBGA package in the target enclosure environment.

Soc System On Chip Part Context

This component belongs to the AMD Versal AI Core series, representing a shift from traditional FPGA architectures to adaptive compute acceleration platforms. It is engineered to address complex workloads requiring both hardware flexibility and software programmability. The part serves as a foundational element for next-generation communication and computing systems.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and pinout include other variants of the XCVC1802 family with different suffixes indicating speed grades or temperature ranges. Cross-series migration to Versal Prime or AI Edge models requires significant schematic and firmware redesign due to architectural differences.