Soc System On Chip XCVC1902-2HSIVSVD1760 product image

XCVC1902-2HSIVSVD1760

$36,524.50
  • Description:IC VERSAL AI-CORE FPGA 1760BGA
  • Series:Versal™ AI Core

SKU:8641f0e68475 Category: Brand:

  
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XCVC1902-2HSIVSVD1760 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AI-CORE FPGA 1760BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVC1902-2HSIVSVD1760

  • Description:IC VERSAL AI-CORE FPGA 1760BGA
  • Series:Versal™ AI Core
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:800MHz, 1.65GHz
  • Primary Attributes:Versal™ AI Core FPGA, 1.9M Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1760-BFBGA, FCBGA
  • Supplier Device Package:1760-FCBGA (40x40)

Soc System On Chip datasheet and documents for XCVC1902-2HSIVSVD1760

XCVC1902-2HSIVSVD1760

Soc System On Chip Overview

The AMD XCVC1902-2HSIVSVD1760 is a Versal AI Core Series System-on-Chip (SoC) FPGA manufactured by AMD. It integrates programmable logic, AI engines, DSP blocks, and Arm processor cores on a single die. The device operates at a core voltage of 800 mV and supports an industrial temperature range from -40°C to +110°C. It utilizes the VSVD1760 package configuration. This component belongs to the XCVC1902 family within the broader Versal adaptive SoC portfolio.

Soc System On Chip Feature Summary

  • Integrates heterogeneous computing resources including AI Engines, DSP Engines, and adaptable logic within a unified architecture.
  • Features dual-core Arm Cortex-A72 application processing units and dual-core Arm Cortex-R5F real-time processing units.
  • Utilizes a scalable network-on-chip (NoC) for high-bandwidth data movement between processing subsystems.

Soc System On Chip Applications

  • High-throughput AI inference and signal processing in cloud and edge environments
  • 5G radio and beamforming digital front-end applications
  • Data center compute acceleration

Soc System On Chip Procurement Notes

Verify the specific suffix HSIVSVD1760 against official AMD documentation to confirm package type and electrical characteristics. Confirm availability status with authorized distributors as supply may be restricted. Ensure compliance with RoHS requirements before integration into final designs.

Soc System On Chip Selection Notes

Select this part based on required AI engine count, DSP block density, and I/O pin count for the target application. Compare performance metrics against other Versal AI Core variants to ensure optimal resource utilization. Validate thermal management capabilities for the intended operating environment.

Soc System On Chip Part Context

This component is part of the AMD Versal AI Core series, designed for adaptive systems requiring high-performance computing. It shares architectural similarities with other XCVC1902 models but differs in package and speed grade specifications defined by the unique ordering suffix.

Soc System On Chip Replacement Considerations

Consult AMD's official cross-reference documentation for verified substitute part numbers. Do not assume functional equivalence with other Versal families without verifying pinout and feature compatibility.

XCVC1902-2HSIVSVD1760XCVC1902-2HSIVSVD1760
$36,524.50
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