XCZU19EG-1FFVB1517E

Soc System On Chip Overview

The AMD XCZU19EG-1FFVB1517E is a Zynq UltraScale+ MPSoC EG device featuring an FCBGA-1517 package. It integrates a quad-core ARM Cortex-A53 MPCore with CoreSight, a dual-core ARM Cortex-R5F MPCore, and an ARM Mali-400 MP2 GPU. The FPGA fabric provides 65,340 Adaptive Logic Modules (ALMs) and 34.6 Mbit of embedded memory. Key electrical parameters include a maximum clock frequency of 1.5 GHz for the application processor, 667 MHz for the GPU, and 600 MHz for the real-time processor. The device supports 660 I/Os and operates within a temperature range of 0°C to +100°C.

Soc System On Chip Feature Summary

• Heterogeneous SoC architecture combining quad-core ARM Cortex-A53, dual-core ARM Cortex-R5F, and ARM Mali-400 MP2 GPU
• High-performance FPGA fabric with 65,340 ALMs and 34.6 Mbit embedded memory
• Integrated high-speed peripherals including PCIe Gen2, USB 3.1, SATA 3.0, DisplayPort, and Gigabit Ethernet
• Support for dynamic memory interfaces such as DDR4, LPDDR4, DDR3, and LPDDR3

Soc System On Chip Applications

• Server processor specifications and data center acceleration
• Embedded system design and hardware engineering prototypes
• Industrial control and automation systems requiring real-time processing

Soc System On Chip Procurement Notes

Verify component authenticity through authorized AMD distributors or certified suppliers. Confirm RoHS compliance status via official datasheets before integration. Ensure handling procedures account for moisture sensitivity levels specified in the manufacturing documentation. Validate package dimensions against the 1517-FCBGA specification to ensure mechanical compatibility with the target PCB layout.

Soc System On Chip Selection Notes

Select this model when high logic density (65K+ ALMs) and significant embedded memory (34.6 Mbit) are required alongside powerful Arm processors. The 1517-pin FCBGA package suits applications needing extensive I/O connectivity (660 pins). Consider the specific speed grade (-1) and operating temperature range (0°C to +100°C) to match environmental constraints. Evaluate power requirements based on the 850 mV core voltage specification.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG series, designed for embedded applications requiring both programmable logic and processing subsystems. The 'EG' suffix typically denotes specific feature sets or packaging options within the broader Zynq UltraScale+ family. It serves as a bridge between traditional FPGA designs and complex SoC implementations, enabling software-defined hardware solutions.

Soc System On Chip Replacement Considerations

Cross-reference with other models in the XCZU19EG series, such as XCZU19EG-1FFVC1760E or XCZU19EG-1FFVF1517E, if different pin counts or package sizes are acceptable. Verify that alternative packages maintain compatibility with existing board layouts and thermal management strategies.