XCZU19EG-3FFVB1517E

Soc System On Chip Overview

The AMD XCZU19EG-3FFVB1517E is a Zynq UltraScale+ MPSoC EG series System on Chip featuring an FPGA fabric with 65,340 Adaptive Logic Modules (ALMs) and 1,143,450 Logic Elements. It integrates a quad-core ARM Cortex-A53 MPCore application processor running up to 1.5 GHz, a dual-core ARM Cortex-R5F real-time processor up to 600 MHz, and an ARM Mali-400 MP2 GPU operating at 667 MHz. The device includes 34.6 Mbit of embedded memory, 72 high-speed transceivers, and supports 660 I/O pins in a 1517-ball FCBGA package.

Soc System On Chip Feature Summary

• Integrated heterogeneous processing system combining 65K ALM FPGA fabric with ARM Cortex-A53, Cortex-R5F, and Mali-400 MP2 cores
• High-speed connectivity via 72 transceivers supporting PCIe Gen2, USB 3.1, SATA 3.0, DisplayPort, and Gigabit Ethernet
• Large embedded memory capacity of 34.6 Mbit distributed across block RAM and distributed RAM resources
• Industrial temperature range operation from 0°C to +100°C TJ with SMD/SMT mounting style

Soc System On Chip Applications

• High-performance industrial automation and control systems requiring deterministic real-time processing
• Advanced test and measurement equipment utilizing high-speed serial interfaces for data acquisition
• Embedded vision and graphics-intensive applications leveraging the integrated Mali-400 MP2 GPU
• Telecommunications infrastructure nodes requiring high I/O density and low-latency interconnects

Soc System On Chip Procurement Notes

Verify component authenticity through authorized AMD distribution channels. Confirm RoHS compliance status as indicated in official datasheets. Ensure handling procedures account for moisture sensitivity classification during storage and reflow soldering processes. Validate package dimensions against the 1517-FCBGA specification prior to PCB layout finalization.

Soc System On Chip Selection Notes

Select this model when design requirements exceed the logic capacity of lower-tier Zynq UltraScale+ devices but do not necessitate the full resource set of larger variants. The EG suffix denotes specific performance and feature sets within the MPSoC family; verify core counts and memory sizes against application needs. Consider thermal management solutions given the 850 mV core voltage and high transistor count in the 40x40 mm package footprint.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG series, bridging programmable logic and embedded processing. It shares architectural similarities with other EG variants like XCZU11EG and XCZU15EG but offers distinct resource scaling. The FFVB1517 suffix identifies the specific speed grade and 1517-ball FCBGA package configuration used in this engineering sample or production unit.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other XCZU19EG speed grades (e.g., -1, -2). For functional equivalence with different resource levels, consider XCZU15EG or XCZU17EG series parts, though software adaptation and board redesign may be required due to varying I/O and logic capacities.