XCZU43DR-2FFVG1517I

Soc System On Chip Overview

The XCZU43DR-2FFVG1517I is an industrial-grade System on Chip (SoC) FPGA from the AMD Xilinx Zynq UltraScale+ RFSoC Gen 3 family. It integrates a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5F real-time processor, and approximately 930K logic units within a 1517-ball FCBGA package. The device features eight 14-bit 5GSPS RF ADCs and eight 14-bit 10GSPS RF DACs for direct RF sampling up to 6GHz. It includes soft-decision forward error correction (SD-FEC) cores, high-speed GTY transceivers, and DDR4 memory interfaces.

Soc System On Chip Feature Summary

• Integrated RF Data Converters: Eight 14-bit 5GSPS ADCs and eight 14-bit 10GSPS DACs enable direct digitization of RF signals below 6GHz.
• Heterogeneous Processing: Combines quad-core ARM Cortex-A53 (up to 1.333 GHz), dual-core ARM Cortex-R5F (up to 533 MHz), and ~930K FPGA logic cells.
• Soft-Decision FEC: Includes integrated Turbo and LDPC decoding/encoding hardware for 5G NR and DOCSIS 3.1 applications.
• High-Speed Interconnects: Features up to 8x 32.75 Gbps GTY transceivers and AXI bus interconnect between processing system and programmable logic.

Soc System On Chip Applications

• Software Defined Radio (SDR)
• Phased Array Radar Systems
• 5G Wireless Infrastructure
• Satellite Communications

Soc System On Chip Procurement Notes

Verify availability status as supply may be limited or restricted. Confirm RoHS compliance and moisture sensitivity level (MSL) requirements prior to ordering. Ensure final use declarations are prepared if export control policies apply to the region. Check for specific ordering suffixes that may affect temperature range or packaging.

Soc System On Chip Selection Notes

Select this model for applications requiring direct RF sampling with integrated baseband processing. Compare against XCZU47DR and XCZU48DR based on specific resource needs; note that XCZU43DR typically lacks the dedicated SD-FEC hard cores found in higher-end variants like XCZU48DR, requiring soft implementation if FEC is critical. Verify I/O count and transceiver availability matches board design constraints.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ RFSoC Gen 3 series, designed to replace traditional multi-chip RF front-ends. It consolidates analog-to-digital conversion, digital signal processing, and protocol handling into a single silicon die, reducing size, power consumption, and latency compared to discrete solutions.

Soc System On Chip Replacement Considerations

XCZU47DR-2FFVG1517I and XCZU48DR-2FFVG1517I are pin-compatible alternatives within the same package. XCZU48DR offers additional SD-FEC hard cores. XCZU28DR-2FFVG1517I is a lower-resource variant in the same form factor. Verify logic density and DSP slice counts when substituting.

Soc System On Chip FAQ

Does the XCZU43DR include hard SD-FEC cores?

No, the XCZU43DR typically does not include the dedicated Turbo/LDPC hard cores found in the XCZU48DR. Forward error correction must be implemented using soft logic resources unless specified otherwise in the specific datasheet revision.

What is the maximum input frequency for the RF ADCs?

The integrated RF ADCs support direct sampling of RF signals with frequencies up to 6 GHz.

What is the operating temperature range for the -I suffix?

The 'I' suffix indicates an industrial temperature range, typically spanning from -40°C to +100°C junction temperature.