XCZU43DR-L2FFVE1156I

Soc System On Chip Overview

The XCZU43DR-L2FFVE1156I is a Zynq UltraScale+ RFSoC device manufactured by AMD. It integrates a Processing System with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors, alongside a Programmable Logic fabric and high-performance RF data converters. The device features 8 channels of 14-bit RF-ADCs and 8 channels of 14-bit RF-DACs, supporting direct RF sampling up to 6 GHz. It utilizes a 1156-pin FCBGA package rated for industrial temperatures (-40°C to +100°C). Key specifications include approximately 930K logic cells, extensive DSP slices, and integrated memory resources designed for complex signal processing applications.

Soc System On Chip Feature Summary

• Integrated 8-channel 14-bit RF-ADC (5 GSPS) and 8-channel 14-bit RF-DAC (9.85 GSPS)
• Quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 Processing System
• Approximately 930K system logic cells with dedicated DSP slices
• Industrial temperature range operation (-40°C to +100°C)

Soc System On Chip Applications

• 5G New Radio base stations and Massive MIMO systems
• Phased array radar and electronic warfare platforms
• Satellite communication ground terminals
• Wideband signal intelligence and spectrum monitoring

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix 'L2' against official AMD documentation to confirm clock frequencies and timing characteristics. Confirm the 'I' suffix denotes the industrial temperature range. Check current availability status as supply levels may vary. Ensure compatibility with required PCB footprint and thermal management solutions for the 1156-pin FCBGA package.

Soc System On Chip Selection Notes

Select this model when multi-channel direct RF sampling is required within a single SoC. Compare logic resource density and DSP slice count against application requirements. Verify that the integrated DDR controller supports the target memory interface. Consider the power consumption profile relative to available cooling infrastructure for the 35x35 mm package.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ RFSoC family, which combines ARM processors, FPGA fabric, and RF transceivers on one die. It succeeds earlier Xilinx architectures by integrating high-speed ADCs/DACs directly adjacent to the programmable logic, reducing analog path latency and board space. The DR variant typically denotes specific RF performance characteristics within the series.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements are limited within the same package. Evaluate other XCZU43DR variants with different speed grades or package options if electrical parameters differ. Cross-family migration to newer UltraScale+ generations requires schematic and firmware redesign due to architectural changes.