XCZU48DR-L2FFVG1517I

Soc System On Chip Overview

The AMD XCZU48DR-L2FFVG1517I is an RF System on a Chip (SoC) belonging to the Zynq UltraScale+ RFSoC Gen 3 family. It integrates a Processing System with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors, alongside programmable logic featuring approximately 930K logic cells. The device includes eight 14-bit 5 GSPS RF-ADCs and eight 14-bit 10 GSPS RF-DACs for direct RF sampling. It operates at speed grade -2 within an industrial temperature range (-40°C to 100°C) and utilizes a 1517-ball FCBGA package measuring 40x40 mm.

Soc System On Chip Feature Summary

• Integrated RF Data Converters: Eight 14-bit 5 GSPS ADCs and eight 14-bit 10 GSPS DACs enable direct RF signal digitization up to 6 GHz.
• Heterogeneous Processing: Combines quad-core ARM Cortex-A53 MPCore (up to 1.333 GHz) and dual-core ARM Cortex-R5F (up to 533 MHz) with FPGA fabric.
• High-Speed Transceivers: Includes sixteen 33 Gbps GTY transceivers supporting protocols such as CPRI, OBSAI, and Ethernet.
• Industrial Reliability: Designed for industrial applications with a specified operating temperature range of -40°C to 100°C.

Soc System On Chip Applications

• Software Defined Radio (SDR)
• 5G New Radio (NR) Base Stations
• Phased Array Radar Systems
• Satellite Communications

Soc System On Chip Procurement Notes

Verify availability through authorized distributors as supply may be limited. Confirm the specific suffix 'L' indicates the correct temperature or packaging variant required for the design. Ensure final use declarations are prepared if the component is subject to export control regulations.

Soc System On Chip Selection Notes

Select this model when direct RF sampling capabilities are required without external mixers. Compare against the '-2' speed grade variant if higher clock frequencies are needed. Verify that the 1517-ball package footprint matches the PCB layout constraints and thermal requirements of the target application.

Soc System On Chip Part Context

This part is part of the Zynq UltraScale+ RFSoC Gen 3 series, designed to consolidate RF front-end functions onto a single chip. It serves as a successor to earlier generations, offering improved data converter performance and integrated soft-decision forward error correction (SD-FEC) cores for modern communication standards.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited. Consider the XCZU48DR-2FFVG1517E for commercial temperature ranges or the XCZU47DR series for similar feature sets with potentially different logic density. Validate compatibility with existing IP cores and board designs before switching.