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XTR101AP is listed in the Sensor And Detector Interfaces range at ChipApex. The manufacturer field lists Burr Brown. Its product description is XTR101 PRECISION, LOW DRIFT 4-20. Review the specifications below when checking this part for your BOM.
The XTR101AP is a precision, low-drift 4-20mA two-wire transmitter manufactured by Texas Instruments in a plastic DIP-14 package. It integrates a high-accuracy instrumentation amplifier with a voltage-controlled output current source and dual-matched precision current references. The device operates on a supply voltage range of 11.6V to 40V and supports an industrial temperature specification from -40°C to +85°C. Key electrical characteristics include a maximum input offset voltage of 60µV, a maximum voltage drift of 1.5µV/°C, and a maximum nonlinearity of 0.01%. The input bias current is specified at a maximum of 150nA.
Verify the specific ordering suffix against the manufacturer's official documentation to confirm the package type and temperature grade. The 'AP' designation corresponds to the plastic DIP-14 variant within the XTR101 series. Ensure that the procurement channel provides valid traceability and authenticity guarantees for this legacy component.
Select the XTR101AP when a through-hole plastic package is required for industrial process control applications. This variant is optimized for environments requiring a wide supply voltage range and high noise immunity. Consider the external transistor option if higher precision is needed to mitigate self-heating effects in the integrated circuit package.
The XTR101 belongs to the XTR101 family of microcircuit two-wire transmitters produced by Texas Instruments. Originally developed by Burr Brown before its acquisition, this component remains a standard solution for remote signal conditioning. The AP suffix specifically identifies the plastic DIP-14 packaging option available within this product line.
The XTR101AU serves as the surface-mount equivalent in an SOIC-16 package. Verify pin compatibility and thermal performance requirements when substituting between package types. No other direct functional replacements are documented in the provided datasheet.
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