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XZMYKVG62W-1 is listed in the LED Indication - Discrete range at ChipApex. The manufacturer field lists SunLED. Its product description is LED GRN/YLW CLEAR CHIP SMD. Review the specifications below when checking this part for your BOM.
The XZMYKVG62W-1 is a bi-color surface-mount LED manufactured by SunLED, designed for discrete indication applications. It features a compact 0605 (1613 metric) package with dimensions of 1.60mm in length and 1.25mm in width. The component emits green light at a peak wavelength of 570nm and yellow light at 590nm. Typical forward voltages are specified as 2.1V for the green element and 2.0V for the yellow element. The device utilizes a water-clear lens to maximize light transmission.
Verify that the specific order matches the manufacturer part number XZMYKVG62W-1 to ensure correct bi-color functionality. Confirm compatibility with standard reflow soldering profiles for 0605 components. Check datasheet specifications for moisture sensitivity level requirements prior to assembly. Ensure supply chain sources provide original manufacturer documentation to validate authenticity.
Select this component when dual-color status indication is required in a minimal board area. The 0605 form factor offers a balance between visibility and footprint efficiency compared to larger packages. Consider the specific forward voltage requirements for both colors during circuit design. Evaluate the viewing angle and intensity specifications against ambient lighting conditions.
This component belongs to the SunLED XZMYK series of surface-mount LEDs. The series provides various configurations including single-color and bi-color options in standard industrial footprints. The XZMYKVG62W-1 specifically addresses the need for distinct color coding in compact digital interfaces without requiring multiple discrete components.
Direct substitutes include other 0605 bi-color LEDs from SunLED such as the XZMYKXVG161W-A, though dimensional and electrical parameters must be verified. Cross-manufacturer replacements require matching package size, pin configuration, and spectral characteristics.
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